[Case] 'Particle-PLUS' RF Magnetron Sputtering
An example of the 'Particle-PLUS' analysis of RF magnetron sputtering, which is one of the film formation methods for dielectric films using process plasma.
"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in plasma analysis within vacuum chambers and can perform simulations of film deposition rates at high speed. - It excels in low-pressure plasma analysis. - It is proficient in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - It supports 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.
- Company:ウェーブフロント 本社
- Price:Other