Reduction of molding defects and improvement of mold life through the introduction of CAE technology.
Improving molding efficiency by maintaining and managing the mold at the appropriate temperature and reducing solidification time!
We propose "reducing molding defects and improving mold lifespan through the introduction of CAE technology." It is possible to transfer technology after you have implemented the software, and if you provide input data, we can offer consulting services that output data on thermal deformation due to differences in linear expansion rates of individual components that make up the mold, external forces (clamping force), contact and friction between components, and creep predictions on the product side. We have included a case study where mold warpage was reduced by 29%. 【Proposal Overview】 ■ To further improve the accuracy of mold temperature predictions and product molding predictions, we propose fluid analysis (CFD) and optimization technologies. <Proposal 1> - Utilizing the open-source general-purpose CFD software "iconCFD" to achieve large-scale calculations at low cost. <Proposal 2> - Utilizing the world-class leading tool for general fluid analysis "ANSYS Fluent." *For more details, please refer to the PDF document or feel free to contact us.
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【Use Case】 ■ Combining resin flow analysis tools and optimization for trade-off optimization of <clamping force> and <warpage> <Input variables for mold design and resin molding> Wall thickness/dimensions/gate position/runner position/holding pressure curve/cooling pipe position ↓ Exploring conditions that satisfy all simultaneously <Evaluation functions for moldability, constraints> Deformation → Minimize Clamping force → Minimize Short shot → Prevent occurrence Weld line position → Move to a location with no appearance issues Air trap position → Move to a location where air can escape ◎ Warpage of the mold reduced by 29% * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We form partnerships with leading-edge software vendors of the era, providing a comprehensive engineering environment necessary to solve our customers' increasingly diverse and complex challenges using top-level domestic digital engineering technologies, including thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions.
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