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Regarding the curing temperature of epoxy resin during sample packaging.

Regarding the curing temperature of epoxy resin during sample packaging.

Even with larger-sized circuit boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.

Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections, but since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener, but when embedding large samples such as printed circuit boards or touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we checked how much heat is actually generated during the curing process. For more details, please refer to the PDF download below. [Overview] ■ Temperature profile acquisition - Without heat generation prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat generation prevention treatment for a large amount of resin (large container) ■ Even with larger printed circuit boards, resin embedding is possible without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.

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[Data] FT-IR Analysis of Transparent Resin

[Data] FT-IR Analysis of Transparent Resin

Introducing the results of IR analysis on peripheral materials for LCD displays and raw materials (pellets) such as fibers!

PMMA (acrylic), PET (polyethylene terephthalate), and PC (polycarbonate) are utilized in many applications, taking advantage of their characteristic transparency. They are essential materials for industrial products such as peripheral components of liquid crystal displays, protective films for mobile device screens, headlight covers, optical fibers, and textiles. This document presents the results of IR analysis of these raw materials (pellets). [Contents] ■ Analysis samples: Characteristics of ester/carbonate-based polymers ■ IR spectra (ATR method) ■ Spectral comparison (overlay) ■ Other related analysis services *For more details, please refer to the PDF document or feel free to contact us.

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Raman UV-curable resin

Raman UV-curable resin

The Raman spectrum reflects the functional groups of organic compounds! The curing reaction can be estimated to some extent.

Our company analyzes the spectra of UV-curable resins before and after UV irradiation. We irradiate UV-curable resins (acrylic-based) with ultraviolet light and obtain Raman spectra before and after irradiation. Through the analysis of the Raman spectra, the curing reaction can be estimated to some extent. For a more detailed analysis of the curing mode, analyses such as GCMS are necessary, but our company can provide not only structural estimation but also reaction estimation through spectral analysis. 【Features of Raman Spectral Analysis】 ■ The curing reaction can be estimated to some extent. ■ We can accommodate not only structural estimation but also reaction estimation. *For more details, please refer to the PDF document or feel free to contact us.

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About the curing temperature of epoxy resin free from hazardous substances.

About the curing temperature of epoxy resin free from hazardous substances.

Measurements were taken to reconfirm the temperature at which heat is generated during hardening!

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C. [Measurement Results] ■ Without heat generation prevention treatment for a large amount of resin (large container) - Heat generation reached up to 138°C during curing ■ With heat generation prevention treatment for a large amount of resin (large container) - Heat generation during curing was kept within 30°C *For more details, please download the PDF or feel free to contact us.

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