In addition to 8 types of standard products, custom manufacturing is possible! The plating serves as the base material, allowing for highly reliable joints.
In recent years, the demand for "laminated water-cooled plates" has been increasing in fields such as semiconductors, lasers, fuel cells, and thermoelectric conversion.
Our company has adopted the P-B joining method, which combines plating and brazing, allowing us to provide products that are significantly cheaper and more reliable compared to traditional diffusion bonding methods.
The sizes range from a minimum of about 10 mm square and a thickness of 0.9 mm, to a maximum of about 300 mm square, with laminations possible up to several dozen layers. In addition to eight standard products, custom manufacturing is also available.
【Features】
■ Plating is applied to the plate and heated in a hydrogen furnace or vacuum furnace
■ The plating serves as the filler material, enabling highly reliable bonding
■ Fine processing through etching allows for the formation of complex water channels
■ While based on oxygen-free copper, production in materials such as stainless steel is also possible
*For more details, please refer to the PDF document or feel free to contact us.
- Company：高木製作所
- Price：Other
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