paste Product List and Ranking from 21 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

paste Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 藤倉化成 本社 Tokyo//Other construction industries
  2. バイオマス開発機構 Kumamoto//Fisheries, Agriculture and Forestry
  3. 住友大阪セメント Tokyo//Building materials, supplies and fixtures manufacturers
  4. 4 リフリート工業会 本部 Tokyo//Other construction industries
  5. 5 null/null

paste Product ranking

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Conductive paste "Dotalite" conductive adhesive series 藤倉化成 本社
  2. Conductive paste "DOTITE" - Materials with characteristic tables will be provided. 藤倉化成 本社
  3. Pomelo Paste "Maxito" バイオマス開発機構
  4. 4 Polymer cement-based rebar rust prevention α rust prevention paste 住友大阪セメント
  5. 5 Polymer Cement Paste "RF Rust Prevention Paste" リフリート工業会 本部

paste Product List

1~15 item / All 51 items

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High-temperature anti-seizing and galling paste Nickel High Temp

High-temperature anti-seizing and galling prevention paste - Nickel High Temp

Nickel high-temp is a compound paste that does not contain lead, copper, graphite, chlorine, or other halides, phosphorus, or silicone, making it suitable for sealing gaskets in ammonia, acetylene, vinyl monomers, and atmospheres. Since it does not contain graphite, it is ideal for protecting stainless steel components used at temperatures above 288°C. Operating temperature range: -54°C to 1427°C.

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Conductive paste "Dotaite" Printed Electronics Series

Fine line printing is possible with screen printing! Optimization of the formulation achieves low resistance with a polymer type.

This document introduces the conductive paste "Dotaite" Printed Electronics series. It provides detailed information on the product's "fine line printing capability," "low resistance," and "high flexibility," starting with an overview of the "PE printing method and line width." The explanations are made clear using diagrams. Please feel free to download and take a look. 【Contents】 ■ Overview of PE printing method and line width ■ Fine line printing capability (1) – (3) ■ Low resistance (1) – (2) ■ High flexibility ■ Water solubility ■ Elasticity and moldability ■ Other variations (1) *For more details, please refer to the PDF document or feel free to contact us.

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Conductive paste "Dotalite" conductive adhesive series

We offer a lineup of high-adhesion types and tin electrode compatible types! A "quick reference chart" that clearly shows the curing temperature is also included!

This document introduces the conductive paste "Dotaite" conductive adhesive series. It includes a "Quick Reference Guide for Selecting Conductive Adhesives," as well as "Property Tables" and "Application Examples," presented with diagrams. Please make use of this information for product selection. [Contents] ■ Quick Reference Guide for Selecting Conductive Adhesives ■ Lineup of Conductive Adhesives ■ Conductive Adhesive Property Table ■ Conductive Adhesive Application Examples ■ Status of Overseas Inventory Registration *For more details, please refer to the PDF document or feel free to contact us.

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Conductive paste "DOTITE" - Materials with characteristic tables will be provided.

We offer a variety of series including conductive adhesives, wiring and contact materials for printed circuit boards, and EMI shielding materials.

"DOTITE" is a conductive paste that our company has been developing, manufacturing, and selling for over half a century. With advanced polymerization, synthesis, and dispersion technologies, we offer a wide range of product series for various applications, including adhesives, EMI shielding, and printed circuits. Customization is also possible to meet your needs regarding conductivity, application methods, application targets, and additional functions. 【Series Lineup】 ■ Conductive Adhesive Series… Offering 9 types with various characteristics, including low-temperature curing ■ EMI Shielding Material Series… Types compatible with high-frequency absorption for 5G and millimeter waves ■ Printed Electronics Series… For applications requiring printing of ultra-fine lines or bending ■ Stretchable and Molding Series… Types suitable for wearable devices and thermal molding *We are currently providing materials that introduce the characteristics and application examples of each series! You can view them via "PDF Download." Please feel free to contact us.

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Introduction of the high conductivity, low-cost silver paste "Dotaite XA-9565".

Introducing a silver paste that achieves high conductivity through low-temperature curing.

Introducing a silver paste that achieves high conductivity through low-temperature curing! This document presents the 'Dotaite XA-9565', which has achieved a low price comparable to polymer-type silver pastes within the high conductivity series of the conductive paste 'Dotaite'. It includes information such as "Product Overview and Key Characteristics," "Comparison with Competing Materials," and "Examples of Possible Applications," all illustrated with charts and graphs. Please feel free to download and take a look. [Contents] ■ Product Overview, Key Characteristics, and Usage Instructions ■ Comparison with Competing Materials and Benefits ■ Examples of Possible Applications ■ Lineup of High Conductivity Pastes, including this product *For more details, please refer to the PDF document or feel free to contact us.

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Rust preventive coating "ZAP Paste" application example [at the ground level of steel posts]

Coating-type anti-corrosion paste "ZAP Paste" application example [Ground level of steel columns]

Coating-type anti-corrosion paste "ZAP Paste" that achieves a thick film and also has sacrificial corrosion protection properties. Example of use: [Ground level of steel columns].

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Rust preventive coating "ZAP Paste" application example [Base of a steel tower]

Coating-type anti-corrosion paste "ZAP Paste" Application example [Base of steel towers]

Coating-type anti-corrosion paste "ZAP Paste" that achieves a thick film and also has sacrificial corrosion protection properties. Example of use: [base of steel towers].

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Rust preventive coating "ZAP Paste" application example [Transmission tower hardware]

Coating-type anti-corrosion paste "ZAP Paste" Application example [Transmission tower wire fittings]

Coating-type anti-corrosion paste "ZAP Paste" that achieves a thick film and also possesses sacrificial corrosion protection properties. Example of use: [Transmission tower overhead line fittings].

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Rust preventive paint "ZAP Paste" usage example [Backside of stairs in a station building]

Coating-type anti-corrosion paste "ZAP Paste" application example [Backside of stairs in station building]

A coating-type anti-corrosion paste that achieves a thick film and also possesses sacrificial corrosion protection properties.

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Rust preventive coating "ZAP Paste" application example [Underneath tank]

Coating-type anti-corrosion paste "ZAP Paste" Application Example [Under Tank]

A coating-type anti-corrosion paste that achieves a thick film and also possesses sacrificial corrosion protection properties.

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McDermid: Introduction to Low Melting Point Solder Paste

Reduce the incidence of HIP and NWO defects! Features of low melting point solder paste are included.

In this document, we introduce "Low Melting Point Solder Paste." It includes sections on "Features of Low Melting Point Solder Paste and Total Cost Reduction" and "Introduction to the Bulk Reflow Process (Paste in Hole: P.I.H)." Additionally, we explain "Drop Impact Resistance Comparison Data" using graphs. Please feel free to download and take a look. 【Contents】 ■ Features of Low Melting Point Solder Paste and Total Cost Reduction ■ Introduction to the Bulk Reflow Process (Paste in Hole: P.I.H) ■ Details of the P.I.H Process ■ Product Lineup Introduction / Drop Impact Resistance Comparison Data ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

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McDermid Solder Paste "HRL1 OM-550"

This is a non-eutectic low melting point solder paste for low thermal resistance substrates, components, and large warping semiconductor parts!

"HRL1 OM-550" is a low-melting-point solder paste. It is designed to improve yield and reduce component warpage, significantly enhancing the drop shock resistance and thermal cycle resistance, which were weaknesses of conventional low-melting-point solder. The melting point is significantly lower compared to "SAC305," achieving energy savings in the assembly process by lowering the peak temperature during reflow from 245°C to 185°C. [Features] - Board life: Continuous printing possible for up to 12 hours - Achieves low voids with various packages such as BGA, MLF, and DPAK - Dramatically improves macro (H.I.P) defects and NWO (Non-Wet Open) defects through low-melting-point reflow - Compatible with both air and N2 reflow - Adaptable to components using SAC305 alloy *For more details, please refer to the PDF document or feel free to contact us.

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McDermid Solder Paste "ULT1 OM-220"

It is suitable for various applications, such as products where substrates and components with low heat resistance may be implemented!

The solder paste "ULT1 OM-220" is a super low melting point product developed for mounting on substrates and components with low heat resistance. It allows for mounting at a peak temperature of 150°C or lower during reflow, enabling secondary mounting without re-melting the boards that have been mounted with "SAC305." This product is suitable for various applications, including consumer electronics, in-cabin automotive products, and medical products, where there is a possibility of mounting on substrates and components with low heat resistance. 【Features】 ■ Peak temperature during reflow: 150°C or lower ■ Mounting of low-cost substrates and components ■ Reduction of warpage of substrates and components during mounting <Compared to SAC (Sn/Ag/Cu) solder> ■ Excellent electrical reliability (cleared JIS Z 3197 and J-STD-0004B surface insulation resistance tests) ■ Low voids (satisfies IPC-7095 Class 3: BGA) *For more details, please refer to the PDF document or feel free to contact us.

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McDermid Dia Attach Paste ATROX800HT2VX

Silver sintered die attach paste has excellent thermal conductivity, minimal resin bleed-out, and low levels of condensable organic matter!

The "ATROX 800HT2VX" is a hybrid silver sintering die attach paste designed for GaN and SiC semiconductor power devices, featuring an exceptionally high thermal conductivity. With minimal resin bleed-out and low levels of condensable organic materials, it ensures excellent package reliability with differentiated performance on thin dies. Additionally, this product is formulated for application using the time-pressure pump commonly equipped on most die bonders. 【Typical Properties (Partial)】 <Uncured> ■Type of Chemical: Thermosetting ■Color: Gray ■Storage Temperature: -40℃/°F ■Shelf Life: 6 months *You can download the English version of the catalog. *For more details, please feel free to contact us.

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