[Column] Behind the Development of CoCo Processing
This is a story related to the development of the "CoCo process," which brings the metal mask opening closer to the pads on the substrate.
This column explains the "development story of CoCo processing." "CoCo processing" can be succinctly described as a method that absorbs the height differences of silkscreen printed characters on the circuit board and brings the openings of the metal mask closer to the pads on the board. By absorbing the height differences of the silk during squeegeeing and bringing the openings closer to the board pads, it is possible to suppress smudging caused by the gap between the board and the metal mask, as well as excessive solder due to the height of the silk, thereby improving the stability of the printing process. [Contents] ■ What exactly is "CoCo processing"? ■ Background of CoCo processing development ■ How the specifications for CoCo processing were determined ■ The subsequent development of CoCo processing ■ Origin of the name "CoCo processing" *For detailed content of the column, please refer to the related links. For more information, feel free to contact us.
- Company:メイコーテクノ
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