glue(resin) - List of Manufacturers, Suppliers, Companies and Products

glue Product List

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Super Flexible Epoxy Adhesive Premium Flexible

Super Flexible Epoxy Adhesive Premium Flexible

Achieving rubber-like elasticity and stretch while maintaining the high reliability characteristic of epoxy resin.

NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It shows high reliability characteristic of epoxy resin, exhibits better heat resistance than rubber (silicone, urethane), and performs adequately even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Heat Resistance Grade

Heat Resistance Grade

It is ideal for high temperature and heat-resistant applications.

- Suitable for various applications in high-temperature environments. For Any High Temp Operating Devices. High Tg, Low Out Gas, Reflow Resistant, Environmental Resistance Uniq Characters: High Tg, Low absorption, Low Outgas, Reflow Resistant Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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"Insulating" grade NIC BOND NB4000 Series

"Insulating" grade NIC BOND NB4000 Series

It is suitable for adhesion to areas requiring insulation. Non Conductive Type

NIC BOND NB4000, 6000 Series Meets the requirements for die bonding in electrical insulation applications, as well as high reliability, workability, and thermal conductivity. High Performance, Thermal Conductive, Non-conductive Epoxy Adhesives. Direct contact information for Nichimoly If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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"Waterproof and dustproof" epoxy adhesive for seals IPX Level 7

"Waterproof and dustproof" epoxy adhesive for seals IPX Level 7

This is a new type of adhesive that combines ultra-flexibility and elasticity with the reliability of epoxy resin.

This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating rubber-like flexibility, a 200% elongation rate, and resistance to reflow, suitable for use in extreme cold to high-temperature environments. Premium Flexibility and 200% extend epoxy for waterproof. We provide Direct contact information for Nichimori HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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NICBOND NB Sires Case Studies for Adhesive Selection

NICBOND NB Sires Case Studies for Adhesive Selection

A must-read before selecting adhesives! A collection of adhesive case studies that can be read in just 10 minutes! [Free Download] Optical, insulating, heat-dissipating, and conductive adhesives.

A must-read before selecting an adhesive! This is a collection of case studies on adhesives that can be read in just 10 minutes. It clearly explains various aspects of optical, thermally conductive, and conductive adhesives. NICBOND is our self-developed adhesive, a culmination of applied chemistry knowledge accumulated over many years of experience. In addition to our standard product lineup that caters to a wide range of applications, we also offer bespoke solutions tailored to each customer's needs. [Contents] ○ Optical adhesives / UV-curable adhesives ○ Thermally conductive adhesives ○ Conductive adhesives For more details, please contact us or download the catalog.

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RF-ID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Camera Module Adhesive Catalog

Camera Module Adhesive Catalog

High-performance adhesive for camera modules

This catalog introduces electronics adhesives manufactured by H.B. Fuller. We offer a wide range of products suitable for the latest camera modules, including those for housing bonding, active alignment, die attach, and FPC reinforcement. Please make use of this for selecting products. 【Featured Products (Excerpt)】 - Low-temperature curing adhesives - UV curing adhesives - UV/thermal or UV/moisture dual curing adhesives - Underfill materials, etc. *For more details, please feel free to contact us.

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低臭、低白化、高機能瞬間接着剤【工業用接着剤】

低臭、低白化、高機能瞬間接着剤【工業用接着剤】

幅広くの工業・電子部品組立用難接着基材の接着に期待できる瞬間接着剤。低臭・低白化の高強度1・2液、光・湿気硬化タイプを扱ってます

ボスティック・ニッタ株式会社)は『瞬間接着剤（シアノアクリレート）』を取り扱っております。 当社の製品は、通常の1液タイプ、構造用接着強度が得られる 2液タイプ（自動塗布可能）や光硬化＋湿気硬化の瞬間接着剤など多彩な取り揃えがございます。木工、工業(難接着基材への瞬間接着)、修理・修補・自動車・電気電子部品の組み立て・固定に適用できます。 【特長】 ■　低白化、低臭気 ■　様々な基材へ適用 ■　密着強度が高い ■　より安全性が高い ■　環境にやさしい ■　柔軟タイプあり ご要望の際はお気軽にお問い合わせください。

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Adhesive for Hard Disk Drives

Adhesive for Hard Disk Drives

It demonstrates high reliability in the assembly of hard disk drives.

This is an adhesive with a long track record in hard disk drive assembly. Features: Low outgassing, low-temperature curing, oil resistance, halogen-free. NIC BOND (Product Number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste this into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

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"Conductive Grade" Silver Epoxy

"Conductive Grade" Silver Epoxy

Ideal for die attach in semiconductors and interconnection between modules and substrates.

The NIC BOND 7000 series is for interconnection of large ICs to small ICs, substrates, and modules.

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World Electric Vehicle Adhesive Market Research Report (～2027)

World Electric Vehicle Adhesive Market Research Report (～2027)

Global Electric Vehicle Adhesives Market (up to 2027): By Resin Type, Shape, Vehicle Type, Substrate, Application, and Region

360iResearch predicts that the global electric vehicle adhesive market, which was valued at $438.30 million in 2021, will reach $571.42 million in 2022 and expand to $2,169.89 million by 2027, growing at a CAGR of 30.55%. This research report provides a multifaceted analysis of the global electric vehicle adhesive market, including sections on introduction, research methodology, executive summary, market overview, market insights, analysis by resin type (acrylic, epoxy, polyurethane, silicone), analysis by form (film & tape, liquid), analysis by vehicle type (electric bicycles, electric buses, electric vehicles, electric trucks), analysis by substrate (composite materials, metals, polymers), regional analysis (North America, United States, Canada, Brazil, Asia-Pacific, Japan, China, India, South Korea, Taiwan, Europe/Middle East/Africa, United Kingdom, Germany, France, Russia, others), competitive landscape, and company information.

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