Adhesives for interconnection of various sizes and types of die attach and modules.
We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RF-ID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html
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basic information
NIC BOND NB7000 Series
Price information
Sample 0 yen. Free Sample Please feel free to contact us.
Delivery Time
Applications/Examples of results
X-ray scintillator IC card Semiconductor die bonding
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Company information
The Nichimori Business Division produces industrial and automotive "lubricants" that support the movement and safety of mechanisms in various aspects of daily life. Lubricants utilizing the properties of molybdenum disulfide, as well as special lubricants that do not use oil, are used in a wide range of applications including electronic devices, automobiles, and large machinery, supporting the smooth operation and safety of mechanisms. We are also developing new lubricants with consideration for environmental and human impact. Furthermore, we are engaged in the development of a wide range of products, including various chemical products and a spray cap that safely and easily removes residual gas, which has become a problem with the disposal of spray cans. Additionally, we aim to expand our business in various fields, including the supply of metallic molybdenum, molybdenum compounds, and adhesives for the electronics industry, as well as the sale of "wine," which can be considered a lubricant for humans. We provide special lubricants and high-performance adhesives.