Analysis of electronic circuit boards and components
Solving customer problems with advanced analysis and "analytical skills"! Introducing case studies of electronic circuit board analysis.
"Analysis of electronic substrates and components" offers surface analysis methods tailored to the customer's desired level of understanding. By employing various techniques such as FT-IR (reflection method, ATR method), XPS surface analysis, and AES depth analysis, we have resolved issues by analyzing the copper surface of electronic substrate wiring patterns. [Case Studies of Electronic Substrate Analysis (Wiring Patterns)] ■ FT-IR (reflection method, ATR method) ■ XPS surface analysis ■ AES depth analysis ■ TOF-SIMS analysis ■ Thermal decomposition GC/MS *For more details, please download the PDF or feel free to contact us.
- Company：イビデンエンジニアリング 環境技術事業部
- Price：Other
