analysis Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

analysis Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. 構造システム・グループ Tokyo//Information and Communications
  2. アイ・エス・ピー Hokkaido//Information and Communications 東京事務所
  3. 環境シミュレーション Tokyo//others
  4. 4 null/null
  5. 4 アイテス Shiga//others
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analysis Product ranking

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Elastic Stress Analysis of Arbitrary Shaped Solid Frames FAP-3 構造システム・グループ
  2. Elastoplastic analysis of arbitrary-shaped solid frames SNAP 構造システム・グループ
  3. For three-dimensional skeletal structure calculations! CADTOOL Frame Structure Analysis 12 3D キャデナス・ウェブ・ツー・キャド
  4. Stress Analysis of Arbitrary Shape Plane Frames "Super Build/FA1"
  5. 4 Ground Penetrating Radar Buried Pipe Cloud AI Analysis AiMaps

analysis Product List

181～195 item / All 367 items

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Analysis of airflow and heat within electronic device enclosures

Analysis of airflow and heat within electronic device enclosures

Ventilation analysis was conducted using numerical simulations within the electronic device enclosure.

In the thermal airflow analysis of electronic device enclosures, we conducted ventilation analysis through numerical simulations within the enclosures. With the improvement of technology, electronic components are increasingly shrinking, making thermal issues within electronic device enclosures unavoidable. The placement of high-heat-generating components and ventilation parts such as fans can significantly affect the performance of the devices themselves. We conducted the analysis to gain insights into this. For more details, please download the catalog.

  • Surveying
  • others

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Entrusted Analysis Service [Thermal Fluid Analysis]

Entrusted Analysis Service [Thermal Fluid Analysis]

We have expertise in thermal fluid analysis in the fields of architecture, civil engineering, machinery, and electronics. Please try our analysis level and cost performance!

We have been engaged in various thermal fluid analysis services for over a decade, working hard and brainstorming with many clients to accumulate a wealth of know-how, insights, and presentation skills. The contracted analysis we provide has many advantages, such as: - Usable even by users who cannot operate software. - Convenient when time is limited or when the volume of analysis work is large. - Results can be interpreted by beginners in reports and other documents. - Conducted by experts, ensuring no concerns about the accuracy of the results. We promise to further enhance the level of analysis through organic collaboration with our clients while shedding light on unknown phenomena through simulation and opening new horizons of knowledge. For more details, please contact us or download the catalog.

  • Surveying
  • Architectural CAD
  • Civil Engineering CAD

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Mold flow analysis

Mold flow analysis

We will check in advance the effects of product shape, resin properties, mold design, and molding conditions.

During product design, by evaluating moldability before mold design and improving design quality, we can reduce defects that occur in later processes and streamline the development process.

  • System kitchen equipment and accessories
  • Kitchen appliances
  • accessories

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Structural analysis

Structural analysis

Improvements in design quality, reduction of man-hours for prototyping and experimentation, and shortening of development periods can be expected.

By utilizing structural analysis, we can expect improvements in design quality regarding product strength, reduction in man-hours for prototypes and experiments, and a shortening of development periods. Our company supports designers facing strength-related issues with products and components through extensive expertise and analytical techniques.

  • Kitchen appliances
  • accessories
  • Rock drills, demolition machines, and excavators

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Hendek Aidek

Hendek Aidek

Providing the desired technology with expertise and know-how in resin! 【Analysis】

Hondoku Aidec provides analysis technology with expertise and know-how in resin. 【Features】 ○ Structural Analysis By utilizing structural analysis, improvements in design quality regarding product strength, reduction of man-hours for prototyping and experiments, and shortening of development time can be expected. ○ Resin Flow Analysis During product design, evaluating moldability before mold design enhances design quality, reduces defects that may occur in later processes, and streamlines the development process. ● For more details, please contact us or download the catalog.

  • Other analytical equipment
  • Scientific Calculation and Simulation Software

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Failure analysis of power devices

Failure analysis of power devices

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

  • Other analytical equipment

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Analysis of semiconductor diffusion layers using sMIM

Analysis of semiconductor diffusion layers using sMIM

Detect changes in concentration as changes in C! The dC/dV signal can also be obtained, making it effective for analyzing the diffusion layer.

At Aites Co., Ltd., we conduct analysis of semiconductor diffusion layers using sMIM. The Scanning Microwave Impedance Microscopy (sMIM) is characterized by signals that have a linear correlation with dopant concentration. sMIM scans the sample by irradiating microwaves from the tip of a metal probe attached to an SPM and measures the reflected waves to obtain sMIM-C images that have a linear correlation with the concentration of the diffusion layer. The C component of Zs obtained from the reflectivity consists of the oxide film capacitance and the depletion layer capacitance. By utilizing the fact that the depletion layer width changes depending on impurity concentration, we detect changes in concentration as changes in C. [Application Examples] ■ sMIM-C: Visualization of diffusion layers and semi-quantitative evaluation of dopant concentration for various semiconductor devices such as Si, SiC, GaN, InP, and GaAs. ■ dC/dV: Evaluation of diffusion layer shape, determination of p/n polarity, visualization of the depletion layer. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other analytical equipment
  • Analysis and prediction system

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as crystal grain distribution and stress-strain as quantitative and statistical data. In the observation of changes before and after compression of a Cu plate, IQ maps, GROD maps, and IPF maps (in the Axis 3 direction) can be used to compare the half-life of crystal grain size before and after compression. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, crystal grain distribution, and stress-strain *For more details, please refer to the PDF materials or feel free to contact us.

  • Electrical Equipment Testing
  • Other analytical equipment

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Backside light emission analysis of SiC devices

Backside light emission analysis of SiC devices

Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!

Our company conducts "Backside Emission Analysis of SiC Devices." SiC is a power device that has less energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In a case study of backside emission analysis of SiC MOSFETs, an overseas SiC MOSFET was subjected to ESD, creating a G-(D,S) leakage, and numerous emissions indicating the leakage points were detected through emission analysis. When the emission points were observed using TEM, damage to the SiO2 film and the SiC crystal was noted. *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Narrowing down defective areas using the EBAC (Absorption Current) method.

Narrowing down defective areas using the EBAC (Absorption Current) method.

"SEM images" and "absorption current images (current sensing)" etc.! It identifies open defects in wiring and areas with high resistance defects.

Our company provides analysis and reliability evaluation services. In the "Narrowing Down Defective Areas Using the EBAC (Absorbed Current) Method," we identify open defects and high-resistance areas in wiring using the EBAC method with a nano-probe and high-sensitivity amplifier. By sensing the absorbed current as voltage, we can obtain a contrast based on the resistance voltage drop within the wiring, allowing us to detect high-resistance defects in TEGs such as via chains. [Analysis Examples Using the EBAC Method] ■ SEM Images ■ Overlaid Images ■ Absorbed Current Images (Current Sensing) ■ Absorbed Current Images (Voltage Sensing) *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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EBSD analysis of flexible printed circuits (FPC)

EBSD analysis of flexible printed circuits (FPC)

We will introduce EBSD analysis that reveals areas where distortion has accumulated in the wiring of the bending section!

We will introduce the EBSD analysis of flexible printed circuits (FPC). Regarding flexible circuits used in products with movable parts or bending mechanisms, we conducted a verification using EBSD to check for differences in the Cu wiring between the bending section and the fixed section. As a result, while no significant abnormalities or differences were observed in the optical images of the wiring in the bending and fixed sections, the EBSD analysis revealed areas where strain is accumulated in the wiring of the bending section and locations where low-angle grain boundaries are concentrated. [Analysis Content] ■ Appearance of the flexible circuit and optical images of Cu wiring - Appearance of the flexible circuit - Wiring in the bending section - Wiring in the fixed section ■ Comparison of Cu wiring in the bending and fixed sections using EBSD - Wiring in the bending section - Wiring in the fixed section *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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LED failure analysis

LED failure analysis

Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Isolation," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "electrically normal," "open, high resistance," etc. 【Initial Diagnosis Items for LED Packages】 ■ Electrical characteristic measurement ■ Appearance observation ■ Lens polishing/package internal optical observation ■ Lighting test (brightness distribution observation) *For more details, please refer to the PDF materials or feel free to contact us.

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Analysis of Li-ion battery separators

Analysis of Li-ion battery separators

I confirmed the blocking function of polymer melting at high temperatures!

We conducted material analysis of the separator used in commercially available Li-ion batteries using FT-IR analysis, and confirmed its function of blocking polymer melting at high temperatures. The document presents the material analysis of Li-ion battery separators and observations of changes in the separator's condition under high-temperature environments, using graphs and photographs. [Analysis Overview] ■ Material analysis of Li-ion battery separators ■ Observation of changes in the condition of the separator under high-temperature environments - The condition changes of the separator were observed over time at a constant temperature of 135°C using FIB/SEM. *For more details, please refer to the PDF document or feel free to contact us.

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Structural analysis of prismatic Li-ion batteries.

Structural analysis of prismatic Li-ion batteries.

Observation using optical microscopy and ultra-low acceleration FE-SEM! Detailed structural analysis and elemental analysis are possible.

By mechanically polishing commercially available rectangular Li-ion batteries and observing them with optical microscopy and ultra-low acceleration FE-SEM, detailed structural analysis and elemental analysis can be performed. The materials introduce the overall structure of the Li-ion battery and detailed structural observations of the Li-ion battery using SEM and ultra-low acceleration FE-SEM, accompanied by photographs. [Analysis Overview] ■ Overall structure of the Li-ion battery and SEM observation ■ Detailed structural observation of the Li-ion battery using ultra-low acceleration FE-SEM *For more details, please refer to the PDF materials or feel free to contact us.

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Structural analysis of nylon 6.10

Structural analysis of nylon 6.10

We will elucidate the characteristics at the molecular level using our FT-IR and thermal decomposition GC-MS!

At AITES, we are conducting a structural analysis of Nylon 6.10. Nylon possesses flexibility and a texture similar to silk, while also having high strength and durability that natural fibers lack, being "stronger than steel and finer than spider silk." We will elucidate these characteristics at the molecular level using our FT-IR and pyrolysis GC-MS. 【Nylon 6.10 Interfacial Polymerization Reaction Mechanism】 1. Electron withdrawal by chlorine leads to a deficiency of electrons in adjacent carbon. 2. Non-bonding electrons from amine attack the carbon nucleophilically. 3. An oxygen atom is activated to form an unstable intermediate. 4. Hydrogen chloride is eliminated, forming an amide bond. 5. Interfacial polymerization progresses, resulting in polymerization. *For more details, please refer to the PDF document or feel free to contact us.

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