Photosensitive Coverlay for Flexible Circuit Boards
Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
The "Photo-sensitive Coverlay (PICC)" is a solder resist for flexible substrates that excels in flexibility, insulation, and manufacturability. With low elasticity, it allows the substrate to be easily bent, contributing to increased design freedom, and since a coverlay is not required, significant thinning and weight reduction of the entire substrate is possible. 【Features】 ■ Suitable for high-density mounting with a minimum opening size of 80–150μm ■ High bendability with no cracks occurring even after over 10 million sliding tests (R=5mm) ■ Can cover the entire outer surface with only PICC, contributing to process shortening and simplification ■ EMI shielding can be directly attached ■ High insulation reliability, compatible with line & space of 25μm/25μm *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
- 企業：タムラ製作所
- 価格：Other
