Inspection device for adhesive cut detection "MODEL 274Q"
Newly developed electric field scanning method to reliably capture changes caused by electric field glue.
274Q inspects the adhesive applied to packaging materials immediately after application, detecting reductions in adhesive quantity and adhesive skipping, thereby preventing the shipment of defective products. It completely overcomes the shortcomings of conventional methods through its unique electric field scanning method.
- Company：テクノス
- Price：Other
