Analysis - メーカー・企業149社の製品一覧とランキング | イプロス

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Analysisのメーカー・企業ランキング

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  1. ニューラルグループ 本店 Tokyo//Information and Communications
  2. ダイコーテクノ Hiroshima//others
  3. ジオテック Tokyo//Other construction industries
  4. 4 環境シミュレーション Tokyo//others
  5. 5 ヒロセ補強土 Tokyo//Other construction industries
企業ランキングへ

Analysisの製品ランキング

更新日： 集計期間:Sep 09, 2026～Oct 06, 2026
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  1. Significant reduction in survey costs! AI traffic volume analysis that automatically measures from video. ニューラルグループ 本店
  2. 宅地造成及び特定盛土等規制法への提案／擁壁計画・安定解析提案 ヒロセ補強土
  3. AI Traffic Analysis <Labor Cost Reduction> ニューラルグループ 本店
  4. 4 WebCAD "PocketMyHome" for Residential Ventilation Simulation 環境シミュレーション
  5. 5 [Case Studies] Proposal for Analysis Services ヒロセ補強土

Analysisの製品一覧

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Structural analysis

Structural analysis

Improvements in design quality, reduction of man-hours for prototyping and experimentation, and shortening of development periods can be expected.

By utilizing structural analysis, we can expect improvements in design quality regarding product strength, reductions in man-hours for prototypes and experiments, and shortened development periods. Our company supports designers facing strength-related issues with products and components through extensive expertise and analytical techniques. - Evaluation and optimization of the structural performance of product shapes - Stress analysis - Can the material of the component withstand stress, and will it break? - Strain analysis - Where will the component fail? - Deformation analysis - To what extent will the shape of the component change? - Sensitivity check - Identification of design parameters that most significantly impact structural performance - Design optimization - Examination of which parameters need to be changed and by how much

  • Kitchen appliances
  • accessories
  • Rock drills, demolition machines, and excavators
  • Analysis

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Resin Flow Analysis and Structural Analysis - Kōtoku Aidec

Resin Flow Analysis and Structural Analysis - Kōtoku Aidec

Providing the desired technology with expertise and know-how in resin! 【Resin Flow Analysis・Structural Analysis】

**Features** ○ Resin Flow Analysis During product design, evaluating moldability before mold design improves design quality, reduces defects occurring in later processes, and streamlines the development process. - Filling analysis - Gate position analysis - Sink mark analysis (prediction of position and depth) - Cooling quality analysis (solidification time difference, surface temperature difference, cooling quality) - Runner balance analysis (optimization of sprue, runner, and gate) - Mold cooling analysis - Holding pressure analysis - Warpage analysis - Weld line and void position - Quality prediction (appearance quality and structural properties of the model) - Prediction of required clamping force ○ Structural Analysis Improvements in design quality regarding product strength, reduction of man-hours for prototypes and experiments, and shortening of development periods can be expected. - Evaluation and optimization of the structural performance of product shapes - Stress analysis - Can the material of the part withstand stress, or will it break? - Strain analysis - Where will the part fail? - Deformation analysis - To what extent will the shape of the part change? - Sensitivity check - Identification of design parameters that most significantly affect structural performance - Design optimization - Consideration of which parameters need to be changed and by how much

  • Other analytical equipment
  • Scientific Calculation and Simulation Software
  • Analysis

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Failure analysis of power devices

Failure analysis of power devices

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

  • Other analytical equipment
  • Analysis

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Analysis of semiconductor diffusion layers using sMIM

Analysis of semiconductor diffusion layers using sMIM

Detect changes in concentration as changes in C! The dC/dV signal can also be obtained, making it effective for analyzing the diffusion layer.

At Aites Co., Ltd., we conduct analysis of semiconductor diffusion layers using sMIM. The Scanning Microwave Impedance Microscopy (sMIM) is characterized by signals that have a linear correlation with dopant concentration. sMIM scans the sample by irradiating microwaves from the tip of a metal probe attached to an SPM and measures the reflected waves to obtain sMIM-C images that have a linear correlation with the concentration of the diffusion layer. The C component of Zs obtained from the reflectivity consists of the oxide film capacitance and the depletion layer capacitance. By utilizing the fact that the depletion layer width changes depending on impurity concentration, we detect changes in concentration as changes in C. [Application Examples] ■ sMIM-C: Visualization of diffusion layers and semi-quantitative evaluation of dopant concentration for various semiconductor devices such as Si, SiC, GaN, InP, and GaAs. ■ dC/dV: Evaluation of diffusion layer shape, determination of p/n polarity, visualization of the depletion layer. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other analytical equipment
  • Analysis and prediction system
  • Analysis

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as crystal grain distribution and stress-strain as quantitative and statistical data. In the observation of changes before and after compression of a Cu plate, IQ maps, GROD maps, and IPF maps (in the Axis 3 direction) can be used to compare the half-life of crystal grain size before and after compression. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, crystal grain distribution, and stress-strain *For more details, please refer to the PDF materials or feel free to contact us.

  • Electrical Equipment Testing
  • Other analytical equipment
  • Analysis

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Backside light emission analysis of SiC devices

Backside light emission analysis of SiC devices

Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!

Our company conducts "Backside Emission Analysis of SiC Devices." SiC is a power device that has less energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In a case study of backside emission analysis of SiC MOSFETs, an overseas SiC MOSFET was subjected to ESD, creating a G-(D,S) leakage, and numerous emissions indicating the leakage points were detected through emission analysis. When the emission points were observed using TEM, damage to the SiO2 film and the SiC crystal was noted. *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment
  • Analysis

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Narrowing down defective areas using the EBAC (Absorption Current) method.

Narrowing down defective areas using the EBAC (Absorption Current) method.

"SEM images" and "absorption current images (current sensing)" etc.! It identifies open defects in wiring and areas with high resistance defects.

Our company provides analysis and reliability evaluation services. In the "Narrowing Down Defective Areas Using the EBAC (Absorbed Current) Method," we identify open defects and high-resistance areas in wiring using the EBAC method with a nano-probe and high-sensitivity amplifier. By sensing the absorbed current as voltage, we can obtain a contrast based on the resistance voltage drop within the wiring, allowing us to detect high-resistance defects in TEGs such as via chains. [Analysis Examples Using the EBAC Method] ■ SEM Images ■ Overlaid Images ■ Absorbed Current Images (Current Sensing) ■ Absorbed Current Images (Voltage Sensing) *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment
  • Analysis

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EBSD analysis of flexible printed circuits (FPC)

EBSD analysis of flexible printed circuits (FPC)

We will introduce EBSD analysis that reveals areas where distortion has accumulated in the wiring of the bending section!

We will introduce the EBSD analysis of flexible printed circuits (FPC). Regarding flexible circuits used in products with movable parts or bending mechanisms, we conducted a verification using EBSD to check for differences in the Cu wiring between the bending section and the fixed section. As a result, while no significant abnormalities or differences were observed in the optical images of the wiring in the bending and fixed sections, the EBSD analysis revealed areas where strain is accumulated in the wiring of the bending section and locations where low-angle grain boundaries are concentrated. [Analysis Content] ■ Appearance of the flexible circuit and optical images of Cu wiring - Appearance of the flexible circuit - Wiring in the bending section - Wiring in the fixed section ■ Comparison of Cu wiring in the bending and fixed sections using EBSD - Wiring in the bending section - Wiring in the fixed section *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment
  • Analysis

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LED failure analysis

LED failure analysis

Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Isolation," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "electrically normal," "open, high resistance," etc. 【Initial Diagnosis Items for LED Packages】 ■ Electrical characteristic measurement ■ Appearance observation ■ Lens polishing/package internal optical observation ■ Lighting test (brightness distribution observation) *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Analysis

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Analysis of Li-ion battery separators

Analysis of Li-ion battery separators

I confirmed the blocking function of polymer melting at high temperatures!

We conducted material analysis of the separator used in commercially available Li-ion batteries using FT-IR analysis, and confirmed its function of blocking polymer melting at high temperatures. The document presents the material analysis of Li-ion battery separators and observations of changes in the separator's condition under high-temperature environments, using graphs and photographs. [Analysis Overview] ■ Material analysis of Li-ion battery separators ■ Observation of changes in the condition of the separator under high-temperature environments - The condition changes of the separator were observed over time at a constant temperature of 135°C using FIB/SEM. *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Analysis

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Structural analysis of prismatic Li-ion batteries.

Structural analysis of prismatic Li-ion batteries.

Observation using optical microscopy and ultra-low acceleration FE-SEM! Detailed structural analysis and elemental analysis are possible.

By mechanically polishing commercially available rectangular Li-ion batteries and observing them with optical microscopy and ultra-low acceleration FE-SEM, detailed structural analysis and elemental analysis can be performed. The materials introduce the overall structure of the Li-ion battery and detailed structural observations of the Li-ion battery using SEM and ultra-low acceleration FE-SEM, accompanied by photographs. [Analysis Overview] ■ Overall structure of the Li-ion battery and SEM observation ■ Detailed structural observation of the Li-ion battery using ultra-low acceleration FE-SEM *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Analysis

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Structural analysis of nylon 6.10

Structural analysis of nylon 6.10

We will elucidate the characteristics at the molecular level using our FT-IR and thermal decomposition GC-MS!

At AITES, we are conducting a structural analysis of Nylon 6.10. Nylon possesses flexibility and a texture similar to silk, while also having high strength and durability that natural fibers lack, being "stronger than steel and finer than spider silk." We will elucidate these characteristics at the molecular level using our FT-IR and pyrolysis GC-MS. 【Nylon 6.10 Interfacial Polymerization Reaction Mechanism】 1. Electron withdrawal by chlorine leads to a deficiency of electrons in adjacent carbon. 2. Non-bonding electrons from amine attack the carbon nucleophilically. 3. An oxygen atom is activated to form an unstable intermediate. 4. Hydrogen chloride is eliminated, forming an amide bond. 5. Interfacial polymerization progresses, resulting in polymerization. *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Analysis

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LCD Panel Analysis Data Collection

LCD Panel Analysis Data Collection

If you're having trouble with LCD analysis, we at ITES are here to help you find a solution!

Are you struggling with LCD analysis? We, at Aites, are here to help you find a solution! Structural Analysis: We evaluate and report on potential issues related to characteristics and structure in FPD products and advanced technologies that are constantly evolving. Failure Analysis: We approach and investigate the causes of manufacturing defects in increasing overseas products through the shortest route. Reliability Testing: Based on your objectives and needs, we propose the optimal reliability testing methods and conditions using our extensive know-how. [Contents] ■ Did you know? What is a display? ■ Panel analysis case studies ■ Tell me more! Aites' LCD analysis ■ Aites can perform these types of analyses!

  • others
  • Other PCs and OA equipment
  • Analysis

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[Data] Degradation Analysis of Polycarbonate by Reaction Thermal Decomposition

[Data] Degradation Analysis of Polycarbonate by Reaction Thermal Decomposition

For material evaluation and defect analysis! We will discuss the applied load and degradation mechanisms based on the differences in decomposition products.

Polycarbonate is a material that excels in impact resistance, weather resistance, and transparency, making it widely used in everything from industrial materials to everyday products. However, even polymers with excellent properties can undergo chemical changes, known as degradation, due to the usage environment and the passage of time. This document presents examples of degradation analysis of polycarbonate materials subjected to UV irradiation and constant temperature and humidity testing. [Contents] ■ Thermal decomposition GC-MS analysis of polycarbonate *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment
  • Analysis

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Analysis of defects in overseas manufactured displays

Analysis of defects in overseas manufactured displays

Numerous achievements in defect analysis! Detailed analysis is possible, from confirming phenomena to inferring the mechanisms of defect occurrence.

Our company conducts "failure analysis of overseas manufactured displays." We can perform detailed analyses, from confirming phenomena to hypothesizing the failure mechanisms and narrowing down the production processes that caused the issues. We carry out lighting observations, panel disassembly, and optical microscope observations tailored to the failure symptoms. If it is necessary to narrow down the defective areas and conduct detailed analysis, we will propose appropriate methods. 【Examples of detailed analysis (partial)】 ■ Cross-sectional observation of wiring ■ Foreign matter analysis ■ Liquid crystal component analysis ■ Electrical characteristic measurement *Additional costs will be incurred. *For more details, please refer to the PDF document or feel free to contact us.

  • Other PCs and OA equipment
  • Analysis

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Reliability evaluation and failure analysis of joints through power cycle testing.

Reliability evaluation and failure analysis of joints through power cycle testing.

We conduct contract testing using Siemens testing equipment! We can also handle the production of various necessary jigs.

We would like to introduce our "Reliability Evaluation and Failure Analysis of Joints through Power Cycle Testing." We can evaluate the joint reliability of various components of power semiconductors and confirm what kind of abnormalities are occurring in defective areas. We can also handle the production of various jigs necessary for testing. Please feel free to contact us when needed. 【Overview of the PWT2400A Device (Partial)】 ■ Equipped with 4 heating power supplies of 600A each ■ Equipped with 16 gate power supplies ranging from -10V to 20V ■ Capable of testing up to 16 channels of devices simultaneously ■ Compatible with water-cooled modules *For more details, please download the PDF or feel free to contact us.

  • others
  • Analysis

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REFZ

REFZ

Zabbix server report creation tool

REFZ is a tool that collaborates with the Zabbix server to generate reports of club images. With simple operations, it can output reports in RTF (Rich Text Format). It is also possible to gather information on "events" and "traps" from the Zabbix server in a consolidated manner. This information can be filtered by the target period and devices, allowing for the output of only the desired information.

  • Other Software
  • Analysis

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Thermal analysis service (thermal simulation)

Thermal analysis service (thermal simulation)

Thermal analysis service (thermal simulation)

Based on years of experience and achievements, we provide services focused on thermal analysis and thermal countermeasure proposals from the perspective of thermal design. We offer services backed by semiconductor device development and system equipment development. We provide a wide range of services from contracted analysis to the sale of measurement systems. (Thermal Simulation) [For more details, please download the catalog or feel free to contact us.]

  • others
  • Analysis

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Case Study: Thermal Analysis (Thermal Simulation)

Case Study: Thermal Analysis (Thermal Simulation)

Reduce product costs with high-precision thermal property analysis! (Thermal simulation)

Are you increasing product costs to ensure product design reliability? If optimal thermal measures are not implemented, excessive measures can reduce market competitiveness, while insufficient measures can increase development costs. However, by optimizing temperature margin design, total costs can be reduced (thermal simulation). Our unique method features localized heating of specific parts of the chip, measuring at the PN junction within the heated area. Additionally, by constructing a simulation model that fits the measurement results, the entire system product can predict temperatures using simulation technology. We also offer consulting services, including the creation of libraries and the standardization of heat dissipation measures and thermal management. For more details, please download the catalog or contact us.

  • others
  • Analysis

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Fast analysis of errors using segment memory and history function.

Fast analysis of errors using segment memory and history function.

This introduces long-duration capture at high resolution using the history function.

During the development of new products, valuable time is lost due to sporadic errors. In an oscilloscope's memory, the memory length for analyzing errors or error history is typically limited to a few milliseconds. This issue can be resolved with large-capacity segment memory and dedicated trigger conditions, allowing relevant sequences to be captured without long pauses. 【Electronic Measurement Solutions】 ■ Single Shot ■ Limit collection to active signal elements ■ History and Segment Memory ■ Easy to set up and quick results *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis

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Generation and Analysis of Wideband Millimeter Wave Signals

Generation and Analysis of Wideband Millimeter Wave Signals

It describes the generation and analysis of V-band signals up to a modulation bandwidth of 500 MHz.

This application note introduces "Wideband Millimeter Wave Signal Generation and Analysis." Generating wideband digital modulation signals at V-band and above is a challenging task, typically requiring a set of multiple devices. To simplify the task, we will also consider the analysis part. [Contents] ■ Introduction ■ Setup ■ Test Results ■ References ■ Order Information *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis

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Analog Modulation Analysis "R&S FPL1-K7"

Analog Modulation Analysis "R&S FPL1-K7"

Easy to use! Introduction to AM/FM/φM demodulators.

The "R&S FPL1-K7" is a demodulation option that converts the "R&S FPL1000" into an analog modulation analyzer for amplitude, frequency, and phase modulation signals. It is capable of measuring not only modulation characteristics but also coefficients such as residual FM and synchronous modulation. Users can choose from low-pass, high de-emphasis, and weighting filters. 【Features】 ■ Demodulation option for R&S FPL1000 ■ Simple and easy to use ■ Converts to an analog modulation analyzer for amplitude, frequency, and phase modulation signals ■ Capable of measuring coefficients such as residual FM and synchronous modulation ■ Selectable from low-pass, high de-emphasis, and weighting filters *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis

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Tribochemical analysis with 'Materials Studio'

Tribochemical analysis with 'Materials Studio'

Simulation of tribochemical (lubrication) reactions: Initially, a material development simulation software compatible with various types of materials.

"Materials Studio" A suite of molecular modeling/simulation tools for next-generation materials development equipped with quantum mechanics (density functional theory), classical mechanics (molecular dynamics calculations), mesoscale (dissipative particle dynamics calculations, etc.), statistics, and analysis/crystallization tools. 【Features】 ■ Simulation software that streamlines material development Available for use by those engaged in research, development, design, and manufacturing across various industries and fields. ■ Supports various types of materials Effective in predicting how the structure of atoms and molecules relates to the physical properties and behaviors of materials in the fields of materials science and chemistry, aiding in the understanding of physical phenomena. ■ Examples Tribochemical (lubrication) reactions Research and development of crystal growth, thin film formation, fuel cells, lubricants, etc. Catalysts, polymers and mixtures, metals and alloys, batteries and fuel cells, etc. ■ Enhanced visualization with "Materials Studio Visualizer" ■ All tasks, including crystal structure creation, calculation condition settings, and calculation result display, can be performed on a single GUI screen. *For more details, please feel free to contact us.

  • Other Software
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Analysis of mixed polymers using 'Materials Studio'

Analysis of mixed polymers using 'Materials Studio'

Simulation of dissolution analysis of polymers and other materials, as well as material development simulation software compatible with various types of materials.

"Materials Studio" A suite of molecular modeling/simulation tools for next-generation materials development equipped with quantum mechanics (density functional theory), classical mechanics (molecular dynamics calculations), mesoscale (dissipative particle dynamics calculations, etc.), statistics, and analysis/crystallization tools. 【Features】 ■ Simulation software that streamlines materials development Available for use by those engaged in research, development, design, and manufacturing across various industries and fields. ■ Supports various types of materials Effective in predicting how the atomic and molecular structures relate to the physical properties and behaviors of materials in materials science and chemistry, aiding in the understanding of physical phenomena. ■ Examples Tribochemical (lubrication) reactions Research and development of crystal growth, thin film formation, fuel cells, lubricants, etc. Catalysts, polymers and mixtures, metals and alloys, batteries and fuel cells, etc. ■ Enhanced visualization with "Materials Studio Visualizer" ■ All tasks, including crystal structure creation, calculation condition settings, and calculation result display, can be performed on a single GUI screen. *For more details, please feel free to contact us.

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We accept thermal fluid analysis of valves and pumps!

We accept thermal fluid analysis of valves and pumps!

Instead of software experts, physics experts will handle the initial meeting and provide analysis results tailored to the customer's needs.

Our company offers contract analysis (outsourced analysis) and consulting as one of the pillars of our business. Based on our extensive know-how cultivated primarily in thermal fluid analysis of pumps and valves, we provide not just simple analysis proposals using software, but also consultations for contract analysis (outsourced analysis) services by physics experts.

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Cooling analysis of motors using 'Simerics MP+'

Cooling analysis of motors using 'Simerics MP+'

Not only applicable to hydraulic circuits such as engines and transmissions, but also has numerous applications in the analysis of oil cooling, water cooling, and air cooling circuits for motors and batteries!

PumpLinx is a fluid analysis software designed to calculate the transient characteristics of various volumetric pumps, compressors, and valves. It is developed based on the thermal fluid analysis software Simerics MP, and utilizes all the features of Simerics MP. 【The following fluid analyses are possible】 ■ Free surface flow ■ Flow considering the compressibility of air contained in liquids ■ Pressure pulsation and water hammer effects ■ Coupling of pump flow with the rigid body motion of valves and cam rings ■ Flow in low to medium vacuum conditions ■ Compressible flow (subsonic) ■ Cavitation ■ Time variation of flow field (velocity vectors, pressure), flow rate, fluid forces, and torque The greatest strength is the ability to automatically create meshes with clearances in the µm range, which is difficult for other general-purpose fluid analysis software!! Recently, there have been increasing inquiries about SimericsMP+ due to difficulties with VOF analysis in other CFD software. SimericsMP+ excels in VOF and has a strong reputation for support. *There is a lot of information that cannot be posted online. In particular, please see a demo for actual mesh creation and movement!

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Analysis of thin film formation on Particle-PLUS microtrench

Analysis of thin film formation on Particle-PLUS microtrench

It is possible to analyze the film formation process from both macro and micro scales.

The particle method plasma analysis software "Particle-PLUS," developed by Wavefront Inc., can analyze magnetron sputtering even in cases where there are micro trenches on the substrate. "Particle-PLUS" is capable of simulating the film deposition process by calculating both the macro scale of the entire sputtering device on a substrate that includes micro trenches and the micro scale concerning the micro trenches! *For more details, please download the PDF or feel free to contact us.

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We will investigate the cause using various methods! HDD/SSD failure analysis service.

We will investigate the cause using various methods! HDD/SSD failure analysis service.

As a manufacturer specializing in HDD/SSD analysis, we conduct various investigations! Please feel free to consult with us first.

We offer "HDD/SSD Failure Analysis Services" and are committed to thoroughly investigating not only the confirmation of failure events but also the true causes behind them. We can conduct various failure analyses, including HDD disassembly investigations, analysis of contaminant gases that have infiltrated the internal components, and verification of the validity of manufacturer failure analysis results. Please feel free to contact us if you have any requests. 【Analysis Contents】 ■ HDD disassembly investigation and analysis of contaminant gases that have infiltrated the internal components ■ Analysis of contaminant components in SSDs (investigation of terminal corrosion and contact failure causes) ■ Investigation of corrosive gas emissions from packaging materials (cushioning materials, sponges, cardboard) ■ Verification of the validity of manufacturer failure analysis results ■ Investigation of outgassing components from materials procured overseas and determination of their usability *For more details, please download the PDF or feel free to contact us.

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Development based on magnetic field analysis and material design technology! 【Magnet for ceramic sensors】

Development based on magnetic field analysis and material design technology! 【Magnet for ceramic sensors】

Manufacturing high-precision plastic/rubber magnet components that can accommodate various industrial products' magnetic sensors!

Today, magnetic sensors are adopted in many industrial products. In particular, many magnetic sensors are installed in automobiles for safety improvements, fuel efficiency, and environmental considerations. Based on the information you provided, we will consider it in line with our design flow, propose product specifications, and guarantee stable mass production. We will also consider complex shapes, dimensional tolerances of 1/1000mm, and insert molding of metal/plastic components. Please feel free to consult with us! [Development Flow] ■ Requirements/Specifications ■ Technical Review/Shape Proposal ■ Prototype Evaluation ■ Mass Production Prototype ■ Prototyping *For more details, please download the materials or contact us.

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FlowDesigner Reverse Analysis!

FlowDesigner Reverse Analysis!

A thermal fluid analysis tool that goes beyond the limits of trial and error.

In general thermal fluid analysis software, designers only input their proposed designs to simulate airflow and temperature distribution. Therefore, if the initial design conditions do not achieve the desired design target, the designer must repeatedly reconsider improvement conditions themselves. To find improvement proposals that can meet the design goals, it is necessary to conduct a vast number of analyses. How can one find a design proposal that achieves the design goals within a limited design review period? FlowDesigner’s inverse analysis function is the only simulation software that can provide the answer!

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