Analysis Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Analysis Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. ユニオンシステム Osaka//Information and Communications
  2. IDAJ Kanagawa//others
  3. ファントム Gunma//Information and Communications
  4. 4 環境シミュレーション Tokyo//others
  5. 5 応用技術 エンジニアリング本部 Osaka//Other construction industries
Go to Company Ranking

Analysis Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Stress Analysis of Arbitrary Shape Plane Frames "Super Build/FA1" ユニオンシステム
  2. Finite Element Analysis (FEA) application "LISA" B7
  3. Image and video analysis AI for flow and behavior analysis at exhibitions and events. ファントム
  4. 3D Dynamic Plasticity Response Analysis "3D DynamicPRO" ユニオンシステム
  5. 5 Thermal Fluid Analysis "Ansys Fluent / Ansys CFX" IDAJ

Analysis Product List

31～45 item / All 394 items

Displayed results
Moving Boundary: Analysis of Internal Airflow in a Sirocco Fan

Moving Boundary: Analysis of Internal Airflow in a Sirocco Fan

The purpose is to investigate the airflow characteristics inside the centrifugal fan.

Moving Boundary: The internal airflow analysis of the centrifugal fan aims to investigate the airflow characteristics within the fan by modeling the basic shape of the centrifugal fan and applying moving boundary conditions to the blades. The centrifugal fan is a multi-blade fan with forward-curved blades, and its characteristics involve many factors such as the shape of the blades, the number of blades, and the shape of the casing. For more details, please download the catalog.

  • Surveying
  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Moving Boundary: Airflow Analysis around Cooling Towers during Fan Operation

Moving Boundary: Airflow Analysis around Cooling Towers during Fan Operation

Adopt a general cooling analysis model to clarify the airflow characteristics inside and outside the cooling tower.

Moving Boundary: The analysis of airflow around cooling towers during fan rotation aims to clarify the characteristics of airflow both inside and outside the cooling tower, using a general cooling model as the analytical framework. Cooling towers are one of the air conditioning systems commonly installed in large commercial facilities, factories, and government offices, and they are devices used to cool circulating water. By spraying water in droplets from above and blowing air with a fan to contact the outside air, the temperature is lowered to produce cooling water. For more details, please download the catalog.

  • Privacy louvers and louver shutters
  • Air compressors, blowers and pumps
  • Surveying

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
SuperCartesian: Engine Cylinder Airflow Analysis

SuperCartesian: Engine Cylinder Airflow Analysis

We conducted airflow analysis within the engine cylinder from the intake manifold to the inside of the cylinder.

SuperCartesian: In the analysis of airflow within the engine cylinder, we accurately represented the intake manifold and valve shapes, and conducted airflow analysis from the intake manifold to inside the engine cylinder. When predicting the performance of an internal combustion engine, it is crucial to understand the airflow characteristics of the mixture being delivered into the cylinder. These airflow characteristics are greatly influenced by the shapes of the intake manifold and valves, which in turn affect combustion efficiency. For more details, please download the catalog.

  • Surveying
  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Airflow analysis within the power supply unit

Airflow analysis within the power supply unit

The purpose is to clarify the characteristics of airflow within the power supply unit.

The airflow analysis within the power supply unit aims to clarify the characteristics of airflow within a typical power supply unit used as an analysis model. The power supply unit plays a crucial role in providing stable power to computers, including PCs, and since it contains many high-temperature heat-generating components, how efficiently it can dissipate heat is a significant point. For more details, please download the catalog.

  • Surveying
  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Close-up Tsunami Load Simulation

Close-up Tsunami Load Simulation

Research has begun with the aim of re-evaluating the tsunami load specifications that should be included in the design of evacuation buildings.

The close-up tsunami load simulation research began with the aim of re-evaluating the tsunami load specifications that evacuation buildings should possess, by gaining a detailed understanding of the behavior of loads on buildings caused by tsunamis resulting from the frequent occurrence of subduction zone earthquakes. However, in light of the unprecedented damage caused by the Great East Japan Earthquake and the resulting massive tsunami, there has arisen a necessity for simulations that were not included in previous settings. Specifically, tsunami load evaluations for wave heights of 10 to 20 meters and assessments of tsunami loads on groups of buildings are now considered essential and urgent for the design of facilities constructed along the coast, not just for evacuation buildings. For more details, please download the catalog.

  • Flood prevention facilities, fire tanks, and flood control ponds
  • Surveying
  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Analysis of Powder and Bulk Material Behavior

Analysis of Powder and Bulk Material Behavior

Consider the behavior and flow of the mechanism! It is possible to improve the performance of construction and heavy machinery systems.

Through the collaboration of our various solvers, we enable high-precision "behavior analysis of powders and bulk materials." It is possible to explore performance improvements in construction and heavy machinery systems. The interactions of mechanisms, powder behavior, structural deformation, and system control can also be considered. Additionally, by using various Altair solvers, we can accurately analyze powder processes that include thermal fluid phenomena (such as transportation by air, particle cooling by wind, and drying processes). 【Performance Improvement of Construction and Heavy Machinery Systems】 ■Mechanisms ■Powder Motion ■Consideration of Deformation and Stress ■Integration of System Control Mechanisms ■Interaction between EDEM soil models and elastic deformation tire models *For more details, please download the PDF or feel free to contact us.

  • Other Software

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Thermal Fluid Analysis SOLIDWORKS Flow Simulation

Thermal Fluid Analysis SOLIDWORKS Flow Simulation

Achieving seamless design and analysis! Add-in thermal fluid analysis software equipped with a variety of result evaluation functions.

"SOLIDWORKS Flow Simulation" is a thermal fluid analysis software developed for all designers working with SOLIDWORKS. With complete integration into SOLIDWORKS, it achieves a seamless design and analysis process. Its diverse result evaluation features allow for the visualization of fluid flow paths using lines and arrows, and results can also be saved as animations. 【Features】 ■ Complete integration with SOLIDWORKS ■ Diverse result evaluation functions - Streamlines: Visualize the flow paths of fluids using lines and arrows - Contours, Probes: Display calculation results on arbitrary sections or surfaces - XY Plots: Output calculation results on arbitrary sketches - Acoustic Evaluation: Graphs of frequency and sound pressure levels can be output for arbitrary times and coordinates *For more details, please refer to the PDF materials or feel free to contact us.

  • Scientific Calculation and Simulation Software
  • Other Software

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

  • Other analytical equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Analysis of the assembly joint of the component.

Analysis of the assembly joint of the component.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

  • Other analytical equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Attention those struggling with material properties in the manufacturing process at the Institute of Chemical Reaction Mechanisms!

Attention those struggling with material properties in the manufacturing process at the Institute of Chemical Reaction Mechanisms!

What is the reason for this discoloration on the surface? Why is there a crack in such a place? These issues will be resolved from the perspectives of electrons, atoms, molecules, and chemical reaction mechanisms!

Many defects occur during the manufacturing process of products and during their use. Among these, there are challenges related to material properties, and for those who are wondering, "It’s probably due to the material, but what should I do about it?", we propose suitable solutions from the perspectives of electronics, atoms, molecules, and chemical reaction mechanisms. ■Examples of Issues - What is causing this discoloration? - Why did it crack so quickly? - What is the reason it tears immediately during a tensile test? *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
EBSD analysis

EBSD analysis

Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.

The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials such as metals and ceramics, which are crystalline, are thought to be composed of numerous crystal lattices like cubes, and this analysis method examines the orientation of these lattices (crystal orientation). Various maps are used, including the IQ map (Image Quality Map), IPF map, GROD map, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.

  • Electrical Equipment Testing
  • Other analytical equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Failure analysis of IC (integrated circuit)

Failure analysis of IC (integrated circuit)

By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.

We would like to introduce Aites Inc.'s "Defect Analysis of ICs." Our company provides a comprehensive approach to ICs by combining methods suitable for different failure modes, from identifying defective nodes to physical analysis. We offer various analysis techniques, starting with "Luminescence Analysis/OBIRCH Analysis," which allows for layout verification using a Layout Viewer, as well as "Layer Delamination/Sample Processing," "PVC Analysis," "Diffusion Layer Etching," and "sMIM Analysis." 【Methods】 ■ Luminescence Analysis/OBIRCH Analysis ■ Layer Delamination/Sample Processing ■ Micro Probe ■ PVC Analysis ■ EBAC Analysis ■ Physical Analysis (FIB-SEM, TEM) *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
OBIRCH analysis of SiC devices using short-wavelength lasers.

OBIRCH analysis of SiC devices using short-wavelength lasers.

Since semiconductors have different physical properties, new methods are required for failure analysis!

Our company conducts OBIRCH analysis of SiC devices using short-wavelength lasers. SiC is a power device with lower energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In the backside OBIRCH analysis of SiC-SBD using short-wavelength lasers, localized melting damage was induced in the SiC Schottky barrier diode, resulting in the generation of a pseudo-leak. Locations of pseudo-leaks that could not be confirmed in the IR-OBIRCH analysis were clearly observed in the GL-OBIRCH analysis. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other analytical equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Failure analysis of electrostatic discharge damaged orange LED.

Failure analysis of electrostatic discharge damaged orange LED.

We will introduce a comparison of the brightness and characteristics of good products and electrostatic discharge (ESD) damaged products, along with examples of luminescence analysis using EMS microscopy!

We conduct failure analysis of orange LEDs that have been damaged by electrostatic discharge (ESD). LEDs that have been destroyed during ESD testing and show a decrease in luminous intensity can be analyzed using emission photometry and the IR-OBIRCH method, allowing us to clarify the failure phenomena. We have examples such as "Comparison of brightness and characteristics between good products and ESD-damaged products" and "Emission analysis using an emission microscope." [Analysis Examples] ■ Comparison of brightness and characteristics between good products and ESD-damaged products - By polishing the lens part of a bullet-type LED to flatten it, a brightness comparison was conducted, revealing dark areas. ■ Emission analysis using an emission microscope - In the ESD-damaged products, dark areas were observed under forward bias, while only the damaged areas emitted light under reverse bias. ■ IR-OBIRCH and SEI analysis - Detailed damage locations were identified through IR-OBIRCH analysis of ESD-damaged products. *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Analysis of good LCD panels

Analysis of good LCD panels

Check the quality status of LCD components and products! We will analyze the structures of the LCD panel using our analytical methods and expertise!

At AITES, we conduct quality analysis of LCD components/products, confirming the quality status of products based on our expertise in LCD technology. The target panels include SEG-LCD, AM-LCD (a-Si TFT / LTPS TFT), OLED for automotive, monitors, mobile devices, and more. We perform quality analysis using our analytical methods on the various structures of liquid crystal panels. 【Analysis Details (Excerpt)】 <Reliability/Lighting Tests> ■ Classification - Reliability Testing - Lighting Inspection ■ Analytical Methods - Oven Drive Testing - Visual Inspection *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to Analysis

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.