List of Measurement and Analysis Equipment products
- classification：Measurement and Analysis Equipment
151～165 item / All 476 items
![[Disaster Measures] A must-see for ...](https://image.www.ipros.com/public/product/image/595/2000904728/IPROS15684834320275806124.JPG?w=280&h=280){kind=small}
Since the construction-generated soil will be recycled on-site, the disposal costs for leftover soil and the costs for new purchases will be significantly reduced. 【Disaster Prevention】
- Special Construction Method
The Noto Reconstruction Office of the Ministry of Land, Infrastructure, Transport and Tourism has featured our 3D printer in the Nikkei newspaper.
The official X account of the Noto Reconstruction Office of the Ministry of Land, Infrastructure, Transport and Tourism and the Nihon Keizai Shimbun have published that our 3D printer has been adopted for the reconstruction of Noto. The official X account of the Noto Reconstruction Office introduces the use of our products in the restoration work of the Noto Expressway. Additionally, the Nihon Keizai Shimbun mentions that structures made with our products are being used for the restoration of roads damaged by the Noto Peninsula earthquake, and that the construction period can be shortened by about two weeks, so please take a look.
Contributing to the second stage of public infrastructure! Bringing public infrastructure development to the ground. A robust outdoor storage tank for hazardous materials capable of responding to the ...
- Water Treatment
Dustproof and waterproof fanless industrial PC
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
Equipped with PoE (×4), a compact fanless design with a wide operating temperature range.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
Compact fanless design with digital I/O and a wide operating temperature range.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
High environmental performance small fanless with PoE
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
High environmental performance compact fanless.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
Compact fanless design with digital I/O and high environmental resistance.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
Compact fanless design with digital I/O and high environmental performance.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
High environmental performance compact fanless.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
Long-term supply, support for three NVIDIA RTX A2000 installations.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
Long-term supply, full-length/full-height add-on cards can be implemented.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
Low-cost standard model
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
Highly versatile industrial rack-mounted type
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
E-Mark and EN-50155 compliant compact fanless for vehicle use.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
Fanless industrial PC equipped with the high-performance AI chip 'Hailo-8 AI Processor'.
- Other PCs and OA equipment
- IoT
- Measurement and Analysis Equipment
We propose analytical methods tailored to materials and purposes! Here are examples of chemical analysis for each component, such as liquid crystals and sealing materials.
- Measurement and Inspection
- Other services and technologies
- Measurement and Analysis Equipment
Observation of conductive particle shapes in COG implementation
We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection state, cross-sectional observations were conducted, revealing that the amount of particle deformation was "medium," indicating an appropriate level of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any investigations related to panel issues.