CSP test socket equipped with adjustable pressure pads
The CSP (Chip Scale Package) / Micro BGA (Ball Grid Array) test burn-in socket product series from Aries features a simple pressure pad compression design that accommodates various ranges of movement without applying excessive pressure to the device. It offers devices with maximum sizes of 6.5 mm², 13 mm², 27 mm², 40 mm², 55 mm², as well as 14 to 27 mm².
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basic information
The CSP (Chip Scale Package) / Micro BGA (Ball Grid Array) test burn-in socket product series from Aries features a simple pressure pad compression design that accommodates various ranges of movement without applying excessive pressure to the device. It offers devices with maximum sizes of 6.5 mm², 13 mm², 27 mm², 40 mm², 55 mm², as well as 14 to 27 mm².
Price information
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Delivery Time
Applications/Examples of results
Debugging, BurnINN, Evaluation
Company information
Since its establishment in 1979, Micron Corporation has primarily engaged in the import, sales, and support of foreign semiconductor components. Our role is to provide total support, including the development environment and information that engineers need, ranging from advanced image devices to innovative analog and digital semiconductors and related tools worldwide. We will continue to contribute to the development of the electronics industry. Main Products: - CMOS image sensors - APEX high current and high voltage operational amplifiers - LEDs (visible light & UV) - X-ray detectors/generators - IC sockets and connectors
