Precision Bonding Device (Semi-Automatic)
This device is used for manually positioning and bonding two substrates, such as glass substrates and optical film substrates. In recent years, the demand for thinner bonded products and higher levels of appearance accuracy has increased. We have consolidated our bonding technology (speed and pressure control mechanisms) into a space-saving device, achieving high-quality bonding without scratches or bubbles.
Inquire About This Product
basic information
This device is designed for manually positioning and bonding two substrates, such as glass substrates and optical film substrates. In recent years, the demand for thinner bonding products and higher levels of appearance accuracy has increased. We have consolidated our bonding technology (speed and pressure control mechanisms) into a space-saving device, achieving high-quality bonding without scratches or bubbles.
Price information
-
Delivery Time
Applications/Examples of results
LCD panel, touch panel
catalog（1）
Download All Catalogs
Company information
We have been designing and manufacturing precision machinery and automation equipment that is unique to each item. Rather than simply automating manual tasks, we delve into the processes themselves to propose new manufacturing systems (methods). That is our solution.
