Systematically acquire semiconductor packaging technology from the basics. Learn about quality control and the latest packaging trends in one day.
■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelation of materials, equipment, and packaging technology - Young engineers related to packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Individuals who wish to systematically acquire knowledge related to semiconductors
Inquire About This Product
basic information
■Event Details Date and Time: November 5, 2026 (Thursday) 10:30 AM - 4:00 PM Participation Fee: 55,000 yen (tax included) *Includes materials *Newsletter subscribers: 49,500 yen (tax included) Instructor: Kazuo Ikenaga (Instructor and Consultant at Success International Co., Ltd. Semiconductor Seminar) Participation Method: This seminar will be a live-streamed seminar using "Zoom." The seminar will provide a comprehensive explanation of packaging functions, structures, manufacturing processes, quality control, and cutting-edge packaging technologies such as WLP, FOWLP, SiP, TSV, and chipletization.
Price information
Participation Fee: 55,000 yen (tax included) *Includes materials *For our newsletter subscribers (registration is free) 49,500 yen (tax included) ★If two or more participants apply simultaneously and all applicants register as newsletter subscribers, the participation fee per person will be half of the newsletter subscriber price.
Delivery Time
Applications/Examples of results
For details about the program and how to apply, please check the related link URL.
Company information
We provide the latest industrial insights to our clients. By conducting market trend analysis, publishing technology‑related books and research reports, and organizing and managing seminars, we support research and development across a wide range of industries, with a primary focus on manufacturing. Our coverage spans diverse fields such as energy, batteries, chemicals, and biotechnology.
![[Data] WTI Blog April 2022](https://image.www.ipros.com/public/product/image/661/2000705596/IPROS69809015131093738787.jpeg?w=280&h=280)
![[Case Study] Sensor Reduces Sorting Time by Half! Higashi Nihon Recycling Systems](https://image.www.ipros.com/public/product/image/add/2001211187/IPROS42997668617422795954.png?w=280&h=280)
![[Case Study] 90% Recycling Rate of Waste Plastics! Meiwa Packs](https://image.www.ipros.com/public/product/image/c34/2001211193/IPROS77251652406533655175.png?w=280&h=280)
