Confirm the position of metal parts and observe voids in solder joints through X-ray transmission observation!
Our company can observe internal structures and voids non-destructively through X-ray transmission observation, and it is possible to confirm the details through cross-sectional observation. In addition to X-ray observation, using SAT (ultrasonic imaging device) allows for a clearer non-destructive confirmation of the layer where voids occur. Depending on the observation purpose and the composition and structure of the sample, there are appropriate processing methods. Our company will consider and propose pre-treatment, processing, observation methods, and combinations based on our accumulated know-how. Please feel free to contact us for consultations. 【Features】 ■ X-ray observation: Allows for non-destructive observation of internal structures and voids ■ Cross-sectional observation: Can observe voids within the solder between heat dissipation plates ■ SAT (ultrasonic imaging device): Can clearly confirm the layer where voids occur in a non-destructive state ■ Rich know-how to consider and propose pre-treatment, processing, observation methods, and combinations *For more details, please download the PDF or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
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