Inline 3D profile measurement device

basic information

【Main Specifications】 - Measurement Method: Laser Triangulation Method - Number of Profile Points on X-axis: Up to 6400 points - Scan Speed: Up to 67 kHz - Z-axis Repetition Accuracy: Minimum 0.1 μm - Measures height, width, step differences, gaps, flatness, and contour shapes without contact - Compatible with various industrial interfaces *Measurement range, accuracy, scan speed, etc., may vary by model. Please contact us for details.

Price range

Delivery Time

Applications/Examples of results

【Main Applications and Examples of Achievements】 - Measurement of height, step, flatness, and 3D shape of automotive and EV parts - Inspection of welding joints and busbars of lithium-ion batteries - Height, flatness, and appearance inspection of smartphones and electronic components - Height and shape inspection of semiconductor and PCB components SinceVision's sensing solutions are adopted by major global manufacturers, including Apple, Tesla, and BYD.

Detailed information

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  3D Inspection of Lithium-Ion Batteries Non-contact measurement of the shape, height, and step of busbar welds, as well as gaps between tabs and electrodes before welding. By rapidly acquiring 3D shapes, it detects welding conditions and minute shape abnormalities inline, contributing to the stabilization of quality in battery manufacturing processes and automated inspection.

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  Inspection of the shape and dimensions of automotive parts High-precision 3D measurement of gaps, steps, flatness, height, and contour shapes of vehicle bodies and automotive parts. Due to non-contact measurement, it can accommodate complex shapes and can be utilized for dimensional inspection and automatic quality assessment during production line assembly.

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  3D inspection of electronic components and consumer electronics High-precision measurement of the height, step, flatness, and contour shape of electronic components and precision parts. It can be utilized for various 3D inspections and quality control in the manufacturing processes of PCBs, PCBAs, smartphones, and electronic devices.

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  3D Inspection of Semiconductors and Wafers High-precision 3D measurement of the height, flatness, step height, and surface shape of wafers and semiconductor components. It can be utilized for various shape and dimension inspections in the semiconductor manufacturing process, including package components such as BGA and LGA.