Examples of cross-sectional observation of wire bonding with various compositions.

We propose processing, pretreatment, and observation methods based on accumulated know-how! We will introduce examples of observation and elemental analysis of various wire cross-sections.

We would like to introduce examples of cross-sectional observation and elemental analysis of wire bonding with various compositions conducted at our company. Wire bonding is a technology that connects electrodes on semiconductor chips to package terminals using metal wires, with materials such as gold (Au), aluminum (Al), and copper (Cu) being used for the wires. The samples presented were prepared by mechanical polishing to create cross-sections, but there are appropriate processing methods depending on the observation purpose, sample composition, and structure. Based on our accumulated know-how, we will consider and propose processing, pre-treatment, observation methods, and combinations. 【Characteristics of Each Wire】 ■ Gold (Au) Wire: Has high conductivity, is chemically stable, and is less prone to oxidation, making it highly reliable. ■ Aluminum (Al) Wire: Suitable for applications that require high current. ■ Copper (Cu) Wire: Has lower electrical resistance and higher thermal conductivity than gold. ■ Palladium (Pd) Coated Copper (Cu) Wire: Improves oxidation resistance and bonding properties. *For more details, please download the PDF or feel free to contact us.

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