Thermal conductivity filler MgO

High thermal conductivity and low hardness thermal conductive MgO filler. For weight reduction, cost reduction, and equipment wear prevention.

As the electrification of automobiles and the high performance of electronic devices progress, thermal management to prevent defects in electronic components has become increasingly important, leading to a growing demand for thermal conductive fillers (materials that enhance heat dissipation and facilitate heat transfer in resins). Traditionally, MgO has been avoided due to its high hygroscopicity, but our company has improved its moisture absorption through high-temperature sintering (over 1800°C) and unique reaction conditions. By ensuring consistent production from raw materials, we deliver high-insulation products with excellent thermal conductivity at low and stable costs. [Application Examples] Thermal interface applications (thermal sheets, thermal grease, adhesives), printed circuit board applications, injection molding applications (thermoplastic resins), sealing material applications (semiconductors, solar cells, LEDs).

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