Exhibited products at the 40th NePCON Japan (Tokyo Big Sight)
We exhibited the following products at the 40th Nepcon Japan from January 21 to January 23 (Tokyo Big Sight).
1. Dicing Tape Bonito 2. Back Grind Tape Wave Clear 3. Heat Resistant Molecular Gradient Film "200Y" / Heat Resistant Adhesive Film "SB Sheet" 4. Heat Dissipation Sheet 5. Chemical Resistant Dicing Tape 6. Electroless Plating LCP Metapian 7. Cleaning Tape 900 Series
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basic information
1. Dicing Tape Bonito 2. Back Grind Tape Wave Clear 3. Heat Resistant Molecular Gradient Film "200Y" / Heat Resistant Adhesive Film "SB Sheet" 4. Heat Dissipation Sheet 5. Chemical Resistant Dicing Tape 6. Electroless Plating LCP Metapian 7. Cleaning Tape 900 Series
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Applications/Examples of results
Functional films and tapes used for masking, protection, transport, mounting, and heat dissipation in semiconductor backend processes.
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Company information
Leveraging our core technologies (with numerous patents), we have a proven track record of adopting our unique and top-tier products in a wide range of industrial materials such as construction materials, automotive, and electronic materials, focusing on adhesion, bonding, and joining. Additionally, by actively applying our proprietary technology, we aim to develop multifunctional sheets that achieve various functions such as heat resistance, heat dissipation, heat storage, conductivity, and barrier properties. Through a consistent system from development to sales, we are expanding new products in emerging functional areas, and our coordinators (technical sales) are committed to challenging customer needs and proposing new products.
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