Solvent-free low linear expansion adhesive
This product is an adhesive that suppresses the coefficient of linear expansion to a level comparable to that of metals. The resulting cured material exhibits high adhesion and heat resistance. Despite being solvent-free, it achieves both a low coefficient of linear expansion and low viscosity. Since the coefficient of linear expansion is similar to that of metals, the risk of delamination issues is significantly reduced.
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basic information
Minimum curing conditions: 80°C for 30 minutes, 90°C for 15 minutes, 100°C for 10 minutes, 150°C for 5 minutes Heat resistance temperature: 107°C
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Applications/Examples of results
Applications that require the reliability of electronic components, etc.
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Company information
The Nichimori Business Division produces industrial and automotive "lubricants" that support the movement and safety of mechanisms in various aspects of daily life. Lubricants utilizing the properties of molybdenum disulfide, as well as special lubricants that do not use oil, are used in a wide range of applications including electronic devices, automobiles, and large machinery, supporting the smooth operation and safety of mechanisms. We are also developing new lubricants with consideration for environmental and human impact. Furthermore, we are engaged in the development of a wide range of products, including various chemical products and a spray cap that safely and easily removes residual gas, which has become a problem with the disposal of spray cans. Additionally, we aim to expand our business in various fields, including the supply of metallic molybdenum, molybdenum compounds, and adhesives for the electronics industry, as well as the sale of "wine," which can be considered a lubricant for humans. We provide special lubricants and high-performance adhesives.