Observation of CMOS image sensor cross-section by mechanical polishing.

Due to the presence of both advantages and disadvantages, it is necessary to choose according to the sample form, observation range, purpose, and so on!

At our company, we created cross-sections of the CMOS image sensor components accompanying the VR goggles manufactured by Company A through mechanical polishing in their original state, and conducted structural observations of the CMOS sensor components. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the cross-section creation methods. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.

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