Compact on-site testing! High-efficiency plating test machine.
This is a device that enables plating tests under conditions closer to actual equipment. By oscillating laterally, simple plating tests can be conducted under vertical transport conditions. Additionally, by replacing the anode case, both soluble and insoluble materials can be examined. Furthermore, conducting plating tests with substrate sizes allows for verification that is closer to actual equipment.
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basic information
Device size: 1,200 × 1,200 × 1,500 [mm] Substrate size: 300 × 300 [mm] Swing stroke amount: ±20 [mm] Liquid volume: approximately 100 [L]
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Company information
Toa Electronics Group is pursuing technology and innovation based on its EMS (Electronic Manufacturing Services) and wet process businesses. In the EMS business, we have established a consistent system from planning and development to assembly and manufacturing, providing electronic device-related services that excel in noise resistance, reliability, and durability. By handling video and content production as well as sound development in-house, we enhance the added value of our products and create unique appeal. In the wet process equipment business, we offer surface treatment equipment and wet process equipment compatible with thin film substrates. Utilizing our unique transport technology to suppress wrinkles, folds, and waviness in substrates, we flexibly accommodate various transport methods (horizontal, vertical, and loop). We have a proven track record of supporting a wide range of substrates, including flexible circuits, rigid circuits, package substrates, and wafers. We pursue the reliability of electronic devices and innovation in surface treatment technology, supporting the next generation of manufacturing -- that is Toa Electronics!
