Introduction of the automatic taping device for wafer ring supply type electrical appearance inspection!
We would like to introduce the "TST Wafer Supply Taping Device" that we handle. This device cuts out wafer-level CSP or substrate-type MCMs, which are attached to an 8-inch wafer ring, one by one using a picker unit. After performing electrical testing and visual inspection, it automatically carries out taping. The electrical testing is customizable (including O/S function tests, withstand voltage tests, etc.), and the taping is done using embossed taping. 【Specifications (partial)】 ■ Supply form: 8-inch wafer ring ■ Supply method: 8-inch wafer cassette for 25 pieces ■ Picker method: bottom push-up, top suction PP transport ■ Electrical testing: customizable (including O/S function tests, withstand voltage tests, etc.) *For more details, please refer to the PDF document or feel free to contact us.
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【Other Specifications】 ■Appearance Inspection - Bottom surface (terminal shape, inspection for large chips and cracks, etc.) - In-pocket (direction, front and back confirmation, text inspection, etc.) ■Taping: Embossed Taping *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Nippon Seizo Co., Ltd. is a company that brings together development firms and manufacturing companies with high technical capabilities. The business groups include the "FA Equipment Manufacturing Group," which plans and manufactures automation equipment, and the "Metal Processing Manufacturing Group," which provides total support from design to processing, welding, and assembly. Additionally, there are other businesses such as the "Construction Material Logistics Manufacturing Group," which manufactures steel structural materials and supports steel structure construction, as well as the "Resin and Special Processing Manufacturing Group" and the "Food Manufacturing Group."