Microprocessor technology has completed a compact, lightweight, and high-precision crack depth measurement tool.
Microprocessor technology has completed a compact, lightweight, and high-precision crack depth measurement tool. It is ideal for measuring the depth of fatigue cracks, as well as for depth measurements after magnetic and ultrasonic testing, and for measuring crack depths in rolls and molds. ■ Features ● Applicable to both magnetic and non-magnetic materials ● Easy measurement: Simply place the probe needle on the crack for digital direct reading ● Digital, pocket-sized, high precision ● Robust shock-resistant design, drip-proof structure ● Built-in data logger (up to 3850 points) with the ability to categorize into 300 types of batch processing; PC data processing software with RS232C output is also available (optional) ● The probe pins are detachable and replaceable.
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basic information
■By measuring the depth of cracks: 1. Determine whether to repair or replace parts on the manufacturing line. 2. Understand the progression of cracks during maintenance inspections to decide on the timing for repair or replacement of equipment. 3. Enable the judgment of the quality of manufactured products. *Easy and accurate measurement with a spring-loaded pin. *Correction data recorded within the probe for improved accuracy. *Accurate measurement of materials such as SUS through multi-point calibration.
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Crack depth measurement
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