It is possible to analyze the film formation process from both macro and micro scales.
The particle method plasma analysis software "Particle-PLUS," developed by Wavefront Inc., can analyze magnetron sputtering even in cases where there are micro trenches on the substrate. "Particle-PLUS" is capable of simulating the film deposition process by calculating both the macro scale of the entire sputtering device on a substrate that includes micro trenches and the micro scale concerning the micro trenches! *For more details, please download the PDF or feel free to contact us.
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【Specifications】 ■Product Name: Particle-PLUS ■Price Range: Please contact us ■Delivery Time: Please contact us *For more details, please download the PDF or feel free to contact us.
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【Calculable Examples】 ■ Magnetron Sputtering ■ PVD, Plasma CVD ■ Capacitive Coupled Plasma (CCP) ■ Electrophoresis, etc. 【Features】 ■ Specializes in low-pressure plasma analysis ■ Combines axisymmetric models with mirror-symmetric boundary conditions to quickly obtain results without simulating the entire device ■ Excels in plasma simulation for low-pressure gases, which are difficult to calculate with fluid models ■ Supports both 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models ■ As a strength of our in-house developed software, customization to fit customer devices is also possible *For more details, please download the PDF or feel free to contact us.
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