The thermal conductivity is high at 1500 W/m·K, allowing for efficient thermal conduction and heat transfer in the plane direction.
It has a high thermal conductivity and excellent freedom of shape, making it suitable for use as a heat dissipation material in electronic devices that require space-saving solutions. 【Features】 ● It has excellent thermal conductivity of 1500 W/m·K in the plane direction and 5 W/m·K in the thickness direction. ● It is bendable, flexible, ultra-thin, and provides high EMI shielding effectiveness, which can also mitigate electromagnetic wave issues. ● It has high stability with no aging changes. ● It can be easily cut and trimmed. ● No adhesive (graphite sheet only).
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basic information
Model number: WW-T68-140140 - Thermal conductivity: 1500W/m·K in the plane direction, 5W/m·K in the thickness direction - Size: 140mm × 140mm × thickness 0.025mm - Thermal diffusivity: 8.5cm²/s - Density: 2.1g/cm³ - Conductivity: >13000 - Bending test: 10000 times - Operating temperature range: -40 to 400℃ - Flame retardancy: V-0 UL94 - Heat capacity: 0.895J/g-K
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Applications/Examples of results
- Electronic components - IC, CPU, MOS, etc. - LED - M/B, circuit board, PS, heat sink, etc.
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Company information
Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent
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