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  6. Examples of semiconductor observation through mechanical polishing.

Examples of semiconductor observation through mechanical polishing.

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last updated:Jul 01, 2024

アイテス
アイテス
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Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors by mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those made by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF document or feel free to contact us.

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Semiconductors

Examples of semiconductor observation through mechanical polishing.

Semiconductors si.PNG
Semiconductors si.PNG
  • Related Link - https://www.ites.co.jp/

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catalog(15)

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Cross-sectional observation of substrate-mounted components (1) to (6)

Cross-sectional observation of substrate-mounted components (1) to (6)

TECHNICAL
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Cross-sectional observation of substrate-mounted components.

Cross-sectional observation of substrate-mounted components.

TECHNICAL
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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

OTHER
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[Data] Structural Analysis of MEMS Components

[Data] Structural Analysis of MEMS Components

OTHER
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Analysis of the assembly joint of the implementation components

Analysis of the assembly joint of the implementation components

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[Data] Cross-section production method

[Data] Cross-section production method

OTHER
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Total support service for LED.

Total support service for LED.

PRODUCT
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LED failure analysis

LED failure analysis

OTHER
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Surface mount electronic component cross-sectional observation service

Surface mount electronic component cross-sectional observation service

PRODUCT
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Cross-section polishing service for implementation parts and electronic components.

Cross-section polishing service for implementation parts and electronic components.

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Examples of semiconductor observation by mechanical polishing

Examples of semiconductor observation by mechanical polishing

OTHER
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Observation of CMOS image sensor cross-section by mechanical polishing.

Observation of CMOS image sensor cross-section by mechanical polishing.

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Observation of tracking camera cross-section by mechanical polishing.

Observation of tracking camera cross-section by mechanical polishing.

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Confirmation of chiplet package structure by mechanical polishing.

Confirmation of chiplet package structure by mechanical polishing.

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Observation of wire bonding shapes

Observation of wire bonding shapes

TECHNICAL
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Examples of semiconductor observation using mechanical polishing.

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In the methods for cross-section preparation in semiconductor structural observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanical polishing, which requires technical skill, is decreasing. However, it is still not to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is comparable to FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing methods according to the observation purpose and the composition and structure of the samples.

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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