Align the mounting surface of components that cannot be reflowed twice! Heavy components will be placed on the back side of the mounting.
We would like to introduce "Implementation," which is a key point in our design. The back of tall components tends to have a lower temperature, so we consider the flow direction of reflow when arranging components. If it leads to mass production, we will adjust the pad dimensions, shapes, and mounting pitches to match the specifications of the mass production factory. 【Features】 ■ Align the mounting surfaces of components that cannot undergo double reflow Heavy components are placed on the back side of the assembly ■ Arrange components considering the flow direction of reflow ■ Match the thermal capacity of the land on both sides of chip components as much as possible ■ Consider the space for soldering iron for hand-placed components *For more details, please feel free to contact us.
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Our company was established in 1977 as a specialized manufacturer of printed circuit boards. Under a thorough delivery management system unique to our company, we achieve a wide variety of products with short delivery times, providing consistent services through a network with strengths in various sales locations and regions. Please feel free to contact us if you have any requests.