High-quality abrasives crushed domestically. Sizes can be customized from a maximum of 80μm to a minimum of 1.2μ according to customer needs!
This is a fine polishing material developed as a wrapping material requiring high precision, featuring a sharp particle size distribution, stable granulation, and a blocky shape. Soft polishing results in a uniform polished surface. Examples of use include wrapping of semiconductor crystals (such as silicon), as well as wrapping of lenses, prisms, crystals, optical glass, and metals. 【Features】 ■ Resistant to scratching even when ground ■ Effective for soft materials and items that should not be scratched ■ Resistant to chemicals and heat *For more details, please refer to the PDF document or feel free to contact us.
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【Physical Properties and Chemical Composition】 ■Raw Materials: A mixture of fused alumina and zircon sand ■Chemical Name: AI2O3 + ZrO2 ■Shape: Brownish, blocky granules *For more details, please refer to the related links or feel free to contact us.*
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【Applications (Partial)】 ■ Semiconductor crystals (such as silicon) ■ Precision lapping materials for compound semiconductors, etc. *For more details, please refer to the related links or feel free to contact us.
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Heisei Sankei Co., Ltd. manufactures high-quality abrasives starting from crushing in Japan. We can customize sizes from a maximum of 80μm to a minimum of 1.2μm. The selection of raw materials, which is the most critical issue in product development, as well as the precision of product particles and density, are seen as significant areas for research and development, leading to a continuous stream of research requests to our company. We constantly challenge the limits of technology as a member of the world's leading companies, contributing to the realization of lower costs and higher quality products, and continue to communicate this to the world.