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  6. Tungsten core wire for semiconductor production

Tungsten core wire for semiconductor production

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35μm

last updated:Apr 21, 2024

アソシエイト トレーディング 土屋 裕 v09018951120 qq3508274141 ttt@zd.wakwak.com
アソシエイト トレーディング 土屋 裕 v09018951120 qq3508274141 ttt@zd.wakwak.com
  • Official site

- Tungsten core wire is the next-generation wire saw core wire for semiconductor production. - The production line started operating in 2024 in Zhuzhou, Hunan.

●Product Name: Tungsten Core Wire for Semiconductor Production ●Wire Diameter: 35μm = 0.035mm (30μm wire is also available) ●Application: Core wire for multi-wire diamond saw → A ●Material: Tungsten W - Rhenium Re 0.6% alloy WR 0.6 → B ●Production Process: W powder → Re doping → Powder metallurgy forging → Round bar → 0.39mm raw wire → Hot drawing through multi-stage die → 0.035mm wire ●Packaging: ・35μm wire: Approximately 120km roll, weight about 20g/km ・30μm wire: Approximately 150km roll, about 17g/km ●Hazardous Materials: No ●Toxicity: None ●Quality Standard: ASTM B760 ●Physical Properties Table: ・Specific Gravity Sp: 19.3g/cm³ ・Melting Point: 3380°C: The highest among metals ●Strength: ・Φ35μm wire: ・Break: 5.7N = 580gf ・Tensile: 5800Mpa ・Φ30μm wire: ・Break: 4.3N = 440gf ・Tensile: 6100Mpa ●Comparison of Physical Properties with High Carbon Steel Core Wire: ・Electrical Resistivity: About half that of carbon steel → C ・Breaking Strength: Over 1.2 times ・Torsional Rigidity: Over 10 times ・Young's Modulus: 1.7 times ・Elongation Ratio: About 60% ●Chemical Properties: ・Reaction with O2: Burns at 400-700°C to produce WO3 → Cooling and oxidation prevention measures are necessary → D

    Solar power generation
1,Φ0.03mm線Re0.6W≧99%マルチダイヤソー基線4t.png

Tungsten core wire for semiconductor production

1,Φ0.03mm線Re0.6W≧99%マルチダイヤソー基線4t.png
1,Φ0.03mm線Re0.6W≧99%マルチダイヤソー基線4t.png

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basic information

Reference 1) A Purpose: Description of the tungsten core wire for multi-wire diamond saws - With the increase in the diameter of silicon ingots, the latest multi-wire diamond saws have started to be used for wafer slicing processing. - The diamond wire has also become longer, now reaching lengths of up to 100 km in a single use. - Currently, high carbon steel wire is the mainstream for the core wire. - Tungsten core wire enables multi-slicing that exceeds the limits of high carbon steel wire. - In other words, with its high breaking strength and high elastic modulus, it allows for the tensioning of thin, high-tensile wires. - Therefore, large diameter wafers can be sliced at high speed with high precision and good mirror finish. B Material: Description of rhenium (Re) addition Pure tungsten (W) has a block-like crystal structure, and the slipping between these blocks leads to creep deformation at high temperatures. By doping with a small amount of Re, it transforms into a long-fiber dense crystal structure, improving its physical properties (non-sagging). C Explanation of electrical resistivity Diamond saws adhere diamond powder around the core wire through bonding or plating. The fact that the electrical resistivity of tungsten is about half that of carbon steel means that the current capacity is about twice as much, allowing for the formation of a thick (diamond-fixed nickel) plating layer.

Price information

- 3,100 yen - 1m roll - 7,600 yen - 10m roll (760 yen per 1m) - 24,000 yen - 1km roll (24 yen per 1m) - 600,000 yen - 100km roll (6 yen per 1m)

Price range

P4

Delivery Time

P4

※- In-stock items: Shipped within a few days - Made-to-order: Approximately one month delivery time

Applications/Examples of results

Reference 2) The following W materials ~ finished products ~ secondary processing are also available. ★ W Finished Products - Dart Game: W Barrel CylinderⓈ: Straightness due to high density - Fishing: W Weight Sinker: Non-toxic with a specific gravity 1.7 times that of lead ★ W Processed Products: - Crucibles - Ball Mill Balls - Electrode Contact ChipsⓈ - Silver Electrode AgW50 ★ W Wire Materials: - Heater Cutter Wire - Vacuum Vapor Deposition Plating Source - Heat Resistant WireⓈ - Heat Resistant Rope - Medical Needles ★ W Materials: Rods, Round Bars, Square Bars, Plates, Pipes, W Powder (Shipping) ★ W Secondary Processing: Powder Metallurgy, Outer Surface Grinding, Inner Surface Grinding, 50μm Laser Dotting Reference 3) These cooling ~ oxidation prevention products are also available. ★ Spin ChamberⓈ: Cold/Hot Separation Swirl Tube: Separates compressed air into cold/hot → blows cold air onto the cutting edge → dry cooling ★ Peltier Elementⓢ: Cold/Hot Separation Semiconductor: When direct current flows → the upper and lower surfaces of the element plate separate into cold/hot → dry cooling ★ PSA Device: Air Separation Deviceⓢ: Separates air into oxygen/nitrogen through the adsorption of the internal Moresi → protects against O2 oxidation with the generated nitrogen gas ★ Molecular Sieveⓢ: Commonly known as Moresi Molecular Sieve: - Activated carbon type for 99% nitrogen generation - Lithium zeolite type for 93% oxygen generation Abbreviations) - W: Tungsten - Ⓢ: Sample Available

Detailed information

  • 2,钨丝Φ0.03-0.04mmt.png

    2, Tungsten wire Φ0.03-0.04mm

  • 3,Φ0.03mm線Re0.6W≧99%マルチダイヤソー基線1t.png

    3. Tungsten wire Φ0.03-0.04mm WRe 0.6 Luchida diamond saw core wire

  • 4,钨丝Φ0.03-0.04mm1t.png

    4,Φ0.03-0.04mm

  • 5,Φ0.03mm線Re0.6W≧99%マルチダイヤソー基線2t.png

    5, Φ0.035mm wire WRe0.6 multi-diamond saw core wire

  • マルチワイヤダイヤモンドソー切断3t.png

    Schematic of the operating principle of a multi-wire diamond saw.

  • マルチワイヤダイヤモンドソー切断1t.png

    Multi-wire diamond saw silicon ingot multi-slice

  • ダイヤモンドワイヤソー

    Diamond wire saw structure diagram

  • ダイヤモンドワイヤソー

    Diamond wire saw 100 km roll

  • ダイヤモンドソー図像分析器t.png

    Diamond wire saw image analysis device

Line up(1)

Model number overview
30μm

Company information

アソシエイト

アソシエイト トレーディング 土屋 裕 v09018951120 qq3508274141 ttt@zd.wakwak.com

Building materials, supplies and fixtures manufacturers

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Associate Trading Co., Ltd. will produce products based on the following policies: 1. As a trading company, we generally do not hold product inventory. 2. The transaction terms are: advanced payment; depending on the product, the lead time is approximately 40 days for made-to-order production. 3. Once the order is confirmed, we will issue an order confirmation. 4. Deliveries will be made in installments as much as possible, allowing users to see and try the products themselves while confirming the quality during delivery. 5. Therefore, we ask users to set lead times that allow for as much flexibility in partial deliveries as possible. 6. For users with ongoing transactions, we generally appreciate your understanding of the stabilization of lead times through procurement from multiple companies. 7. In the unlikely event that there are issues with quality, lead time, cost, or transportation, flexible responses can be made through procurement from multiple companies. 8. Our company directly deals with approximately 500 factories in China, so you can trust us to handle your needs with confidence.

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