It is a paste-like thermal conductive material that has a hardness intermediate between thermal conductive grease and thermal conductive sheets.
It is used to fill the gap between the heating element and the heat sink, allowing efficient heat conduction from the heating element to the heat sink. 【Features】 ● Silicone-free (does not use silicone-based materials), so low molecular siloxanes are not generated, eliminating issues such as electrical contact failure. ● Excellent adhesion and conformity to uneven surfaces and curved surfaces, providing reliable thermal conductivity performance. ● High viscosity allows for vertical application without dripping. ● Being clay-like, it can adhere more closely to each component compared to conventional thermal conductive sheets. ● No worries about pump-out. ● Electrically insulating. ● Applied using a dispenser. ● Available as a set with thermal conductive paste and dispenser, thermal conductive paste only, or dispenser only.
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basic information
Thermal conductivity: 8.0 W/m·K Viscosity: 430 Pa·s Density: 3 g/cm³ Volume resistivity: > 10^13 Ω·m Operating temperature range: -40°C to 125°C Capacity: 30 ml Insulation properties
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Applications/Examples of results
● Thermal management of heat-generating components in electronic and electrical devices. ● Thermal management of CPUs and ICs. ● Thermal management of power ICs. ● Thermal management of power supplies. ● Thermal management of all heat-generating bodies.
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Company information
Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent