Semiconductor manufacturing process TCB (Thermal Compression Bonding) release film "HR-S051"
Combining the thermal stability of PI and the release properties of PTFE! Suitable for preventing chip damage and contamination of bonding materials on press plates.
"HR-S051" is a release film that combines a polyimide film with a fluororesin (PTFE) layer. Due to its thinness, it has excellent thermal conductivity and can be used at high temperatures above 300°C. It possesses the thermal stability of PI and the release properties of PTFE, excelling in heat resistance, mechanical strength, dimensional stability, and release performance. 【Features】 ■ Combines the thermal stability (mechanical strength, dimensional stability) of polyimide with the release properties of PTFE ■ Excellent heat resistance, usable as a release film even at high temperatures of 300°C ■ Superior thermal conductivity due to its thinness *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Characteristics】 ■Thickness [mm]: 0.03 ■Tensile Strength [MPa]: 205 ■Elongation [%]: 50 ■Surface Roughness (Rmax) [μm]: 0.5 to 1 ■Thermal Conductivity [W/(m-k)]: 0.15 ■Dimensional Change Rate at 300℃ for 1 minute ・Length Direction (MD) [%]: -0.04 ・Width Direction (TD) [%]: -0.02 *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ For semiconductor TCB (thermal compression bonding) process release ■ Prevention of chip damage ■ Prevention of contamination of bonding materials on the press plate *For more details, please refer to the PDF document or feel free to contact us.
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Our company is responsible for the living environment business within the Nitto Group and is engaged in important business activities that broadly relate to the socio-economy, including MRO and infrastructure businesses. We offer a wide range of products from over 400 related manufacturers and functional processed products, and we possess the know-how to quickly respond by transforming "customer voices" into tangible solutions. "Company Overview" Company Name: Nitto L Materials Corporation Established: June 1, 1979 *Formerly known as El Nissho Co., Ltd. Name changed in 2015 Capital: 800 million yen (100% owned by Nitto Denko Corporation) Annual Sales: 12.2 billion yen (Fiscal Year 2023) Number of Employees: 100
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