An industry-standard device boasting a large number of delivery achievements! Equipped with linear array photodetectors.
The "Model3100" is an optical interference film thickness measurement device that employs a linear array sensor for high-speed measurement. By standardly equipping spectral analysis software, it enables simultaneous measurement of multilayer films (typically up to three layers) and measurement of optical constants (n, k). It allows for fine-tuned parameter settings suitable for various film characteristics, enabling more diverse film thickness measurements for various film structures. 【Features】 ■ Capable of measuring up to 70μm in equivalent oxide film thickness with a high-sensitivity, high-resolution head (optional) ■ 100x lens (for a micro spot of φ0.75μm) is also available ■ Easy implementation of program settings for special film measurements suited to the process ■ Supports various applications (magnetic heads, FPD, materials research, etc.) and allows for the creation of sample stages tailored to specific uses (optional) *For more details, please refer to the PDF materials or feel free to contact us.
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【Basic Specifications (Excerpt)】 <Model: 3100 (Standard Head)> ■ Measurement Program: Capable of measuring multilayer films (typically up to 3 layers) regardless of substrate material ■ Measurement Wavelength Range: 380–800 nm ■ Film Thickness Measurement Range: 100 Å–30 μm (depending on film thickness) ■ Measurement Reproducibility: 2 Å (1σ for 15 measurements at the same point) *depends on film thickness ■ Measurement Time: 0.1–25 seconds per point ■ Objective Lens (Spot Size): 5x (φ50 μm) ■ Objective Lens Options: 10x (φ25 μm), 50x (φ5 μm) ■ Equipment Configuration: Visible light, holographic concave diffraction grating, linear array element *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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We handle various inspection and analysis equipment, including new and used devices. (Fully automatic XPS film thickness concentration measurement device, overlay accuracy measurement device, double-sided coordinate measurement device, film thickness measurement device, ellipsometer, optical three-dimensional measurement device, wafer edge inspection device, transparent wafer front and back defect inspection device, appearance inspection device, optical microscope, exposure device)