Thermal Form Gas Gasket (TFG)

Heat-resistant polyurethane foam is applied as the core material! The recovery rate and adhesion strength have also improved, resulting in excellent heat transfer performance.

The "Thermal Form Gasket (TFG)" is a thermal conduction component that transmits heat from heat sources (such as circuit elements) to heat sinks or metal plates in a short time, effectively dissipating heat and lowering the temperature of the heat source. It uses graphite with excellent horizontal thermal conductivity (400W/mk). The thickness limitation of silicone pads is eliminated, allowing for a wide range of applications. 【Features】 ■ No need for a heat sink for heat dissipation (direct contact with the case or frame for heat dissipation) ■ Both the surface and sides of the graphite are wrapped in PET film to prevent particles from the graphite from being released ■ Excellent elasticity allows for no excessive pressure on the PCB, preventing bending ■ Various sizes and shapes can be manufactured according to application, making it easy to adjust thermal performance and hardness *For more details, please refer to the PDF document or feel free to contact us.

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