Innovations in EMI shielding support the transition to higher communication frequencies and more compact semiconductor package architectures.
This research report investigates the current status and technological trends of EMI shielding, which is essential for many electronic circuits. Leveraging IDTechEx's expertise in the development evaluation of both advanced semiconductor packaging and conductive inks, it provides a comprehensive overview of the current state, technological innovations, players, and opportunities in this crucial field. 【Contents】 - Film formation methods for package-level shielding - Materials for EMI shielding - Application areas of EMI shielding Report details https://www.dri.co.jp/auto/report/idt/230906-emi-shielding-for.html
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**Summary (Excerpt)** ■ Publisher: IDTechEx ■ Publication Date: Year 2023 ■ Number of Pages: 224 ■ Language: English *Our data resources are authorized sales agents for IDTechEx.*
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