Tohoku University Technology: Manufacturing method and device for aluminum nitride particles: T18-355
High production yield and extremely low energy consumption!
Aluminum nitride (AlN) is known to be used as a filler in the sealing resin of electronic components and semiconductors to efficiently dissipate the heat due to its high insulation and thermal conductivity, and can significantly improve their life. However, the shape of the AlN particles produced by sintering at high temperature for a long time is extremely irregular, and it is not possible to include a large amount of AlN particles uniformly in the sealing resin. This invention is able to simply provide AlN particles with a new configuration that can be suitably used as a thermally conductive filler. In this invention, carbon & alumina particles are mixed and placed in a crucible, then irradiated by microwaves, contrary to conventional method where alumina particles are completely reduced by carbon particles.
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The revenue generated from technology transfer is reinvested into universities and researchers as new research funding, which is used to create further research outcomes. To ensure the smooth operation of this cycle, known as the "Intellectual Creation Cycle," we will actively promote technology transfer. The types of seeds we handle include patents, know-how, databases, and programs. We have established a collaborative framework by concluding basic technology transfer agreements with the following universities (as of June 1, 2025): - Tohoku University - Hirosaki University - Iwate University - Akita University - Fukushima University - Yamagata University - Tohoku Gakuin University - Iwate Medical University - Fukushima Medical University - Aizu University - Miyagi University - Hokkaido University - Muroran Institute of Technology - Showa Medical University
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