A collective manufacturing technology suitable for mass production of lightweight, compact, waterproof electronic components.
Mass production technology for compact electronic components with high dustproof and waterproof performance, packaging press parts, LED elements, sensors, ICs, and more in a unique structure!
This is a unique packaging technology designed to achieve electronic components with excellent dust and water resistance. It enables miniaturization, which was a challenge in traditional methods using lead frames. 【Features】 - Dust and Water Resistance The core components can be sealed through lamination, achieving dust and water resistance. (The IP level varies depending on the selected components and the packaging structure suited for the application.) - Improved Productivity This technology allows for the lamination of a large number of core components at once, followed by dicing to produce individual pieces, enabling the manufacturing of thousands to tens of thousands of electronic components simultaneously. This significantly enhances productivity compared to traditional packaging using lead frames. Additionally, by sealing multiple core components in a single product, the added value of the product can also be improved. Furthermore, some optical components can be produced without molds, allowing for shorter lead times. - Miniaturization By replacing the lead frame with a circuit board, the line width can be narrowed to around several tens of micrometers. This also allows for the miniaturization of the components themselves. For example, in our tactile switches, we have achieved a 20% reduction in size compared to conventional products.
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basic information
■Specifications of electronic components that can be manufactured: - Type: Surface mount - Size: To be discussed - Core components that can be sealed: Metal parts, LED elements, sensor elements, ICs, etc. *Manufacturing of the core components themselves can also be performed by our company depending on specifications. ■Overview of packaging methods: - After placing the core components on the circuit board, laminate them with sheet-like materials. - By laminating a large number of core components at once and then using a dicing saw to cut them into individual pieces, a large quantity of electronic components can be produced at once (in practice, 1800 electronic components were produced at once). - Dustproof performance: Equivalent to IP6X (depends on the selected materials for each package). - Waterproof performance: Equivalent to IPX7 (depends on the selected materials for each package). - Operating environment (temperature, humidity, light levels, etc.): Depends on the core components. - Reflow compatible depending on the packaging materials.
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Company information
Our company excels in the field of small precision and high-accuracy components and modules. We are engaged in the electronic device business centered around LEDs, the switch business applying mechatronics technology, and businesses utilizing LED, precision molding technology, and modularization technology.
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