Ideal for visual inspection of ceramic substrates and power semiconductors! TY-VISION M109SC has a proven track record in detecting cracks, discoloration, and chipping!
The "TY-VISION M109SC" is a final appearance inspection device for circuit boards that accommodates larger-sized products. 【Effective inspection size: 400(W)×500(D)mm】 It employs a high-resolution camera that covers the imaging width at a high resolution of 5µm, and enables comfortable defect detection through an inspection setting method that considers usability. Detailed settings can be made to match the complex inspection standards of each user. We will determine the inspection specifications according to your requests and provide the best final appearance inspection system for you. 【Features】 ■ Large inspection stage × high-definition camera ☐ Reduces false positives and achieves labor-saving through integration with our unique AI system "XAIS"! ■ Detection capability that does not miss minor defects ■ Excellent software for products that pursue high-quality inspections Detailed settings can be made to match the inspection standards of each product. *For more details, please refer to the PDF document or feel free to contact us. #Ceramics #Ceramic #PowerSemiconductors #BoardInspection #InspectionEquipment #AppearanceInspection #FinalAppearance #AI #AFVI #Inspection #CircuitBoard
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basic information
【Specifications】 ■Board size (mm): up to 305×510 ■Board thickness (mm): 0.1 to 2.4 ■Camera type: Color line sensor camera (7.3K or 16K) ■Camera angle: Switchable in 3 stages ■Resolution: 5μm / 10μm (fixed at shipment) ■Light source: White LED (adjustable light intensity for each entry) ■Power supply: AC 200–230V ±10% single phase 50/60 15A ■Device size (mm): 1131(W)×1430(D)×1542(H) (main unit during operation) *For more details, please refer to the PDF document or feel free to contact us.
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Final Appearance Inspection System for Substrates * Ceramics for Power Semiconductors * Surface inspection for general-purpose ceramics! * Compatible with high-resolution substrates for package and module systems * Compatible with FPC (Flexible Printed Circuit Board / Flexible Substrate)
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced variants, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while we are advancing further miniaturization and high density technically, we are also undertaking new initiatives such as bump-type and electroplating with special materials. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in mass production sites for FPC and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs in the future. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*