αGEL's heat dissipation (thermal management) solution

Extraordinary softness combined with thermal conductivity! Achieving high heat dissipation performance by utilizing adhesion and conformity.

We propose a thermal dissipation solution that is adopted in a wide range of applications. By imparting thermal conductivity to the exceptional softness of 'αGEL', we achieve high thermal dissipation performance that leverages its adhesion and conformity. It is possible to balance flame retardancy and electrical insulation while reducing the load on the substrate. We offer a wide product lineup including sheet form, liquid (grease, putty, two-component curing), EMI countermeasures, double-sided tape, and non-silicone options, allowing us to cater to various customer applications. 【Features】 ■ High thermal conductivity of up to 20W/mK combined with flexibility, demonstrating excellent thermal dissipation performance ■ Adheres and conforms to fine uneven surfaces, facilitating heat transfer by eliminating air pockets ■ Usable over a wide temperature range (-60℃ to 200℃) ■ High flame retardancy and electrical insulation, providing stable performance over the long term ■ Low rebound and low compressive stress *For more details, please refer to the related links or feel free to contact us.

Subsidiary materials