Stable communication, data communication efficiency, and power saving achieved. Wi-Fi 6 + Bluetooth compatible wireless LAN combo module.
This is an SDIO-type wireless LAN combo module compatible with Wi-Fi 6 and Bluetooth(R) v5.3. Equipped with the NXP IW611 chipset, this product features a wealth of capabilities unique to Wi-Fi 6, such as OFDMA and MU-MIMO. The adoption of the SDIO interface ensures a balance between power efficiency and communication performance. Additionally, its support for a wide temperature range makes it an ideal wireless LAN module for a variety of products, from industrial equipment to compact devices. Product Features: - PHY data rate up to 600 Mbps (5GHz / 80MHz / MSC11) - Single stream, 1x1 - NXP IW611 chipset - Host interface: Wireless LAN SDIO 3.0 compatible, Bluetooth UART - 80MHz band mode (5GHz) - High-density modulation mode (1024 QAM) - Bluetooth v5.3 Class 1 compatible (planned) - RoHS compliant - Wireless standard compatibility (planned): Japan, USA, Canada, Europe, UK For more details, please contact us or download the catalog.
Inquire About This Product
basic information
Embedded applications: medical devices, mobile printers, handheld terminals, barcode readers, sensor devices, etc. *Specifications are subject to change without notice for improvement purposes.
Price information
Please contact us.
Delivery Time
※Scheduled for shipment in August 2023.
Applications/Examples of results
Embedded applications: automatic transport carts, endoscopes, handheld terminals, label printers, document scanners, IP phones, etc.
catalog（2）
Download All Catalogs
Company information
Silex Technology Corporation (Headquarters: Seika Town, Kyoto Prefecture) is a research and development-oriented company centered on hardware and software technology. We provide products and services that create a wireless environment with reliable connectivity using safe and high-reliability wireless technology and embedded know-how for customers in the medical and industrial sectors. Through the creation of a "seamless wireless space," we realize the best customer experience. We are expanding our global business through collaboration with overseas partners and the development of new markets via our bases in North America, Europe, China, and India. By overseeing the entire process from design and development to production and quality assurance at our "Keihanna Headquarters," we strictly maintain quality standards while also responding to diverse customer needs in each region through a development system that collaborates with overseas bases, including custom engineering on-site.
