Environmentally friendly! Cross-linked low-foaming polypropylene sheet F-cell

We have added a strength evaluation video to the introduction page of "Fcell"! Please take a look. "Fcell" is a lightweight foam PP material that possesses rigidity, durability, and cushioning properties, used in packaging materials, cushioning materials, protective materials, signage, stationery, and more. It is lightweight yet rigid, with excellent heat resistance, water resistance, and chemical resistance. Additionally, it has excellent processability, allowing for punching, heat sealing, and adhesive processing. It features a soft and warm texture, and is suitable for screen, gravure, and offset printing. 【Features】 ■ Lightweight and strong ■ Beautiful appearance, excellent printability ■ Outstanding processability ■ High-performance eco-friendly, hygienic, and non-toxic ■ Anti-static treatment makes it resistant to dust and dirt

**Features of F-Cell** 1. As it is a non-crosslinked product, it can be recycled. Collected molded products can be re-extruded and molded again. 2. By foaming, the material density decreases, resulting in lightweight materials. 3. Foaming reduces the amount of plastic used. (Compared to solid products, 2x foamed products reduce by 50%, 3x foamed products reduce by about 67%, and 4x products reduce by 75%.) 4. The entire lineup is environmentally friendly, using recycled materials. (RC grade contains over 50% recycled material, while other grades contain over 20% recycled material.) 5. Green power is used during manufacturing. Combined with the use of recycled materials, CO2 emissions are reduced by 58% compared to our conventional products. (*Calculated using our own method) **Applications** ■ Packaging Returnable boxes, dividers, cushioning materials, folding containers, etc. ■ Stationery Files, file boxes, drawing files, albums, POP displays, etc. ■ Others Core materials, spacers, enclosures ■ Static electricity prevention and conductive grades Returnable boxes and dividers in dust-sensitive environments, packaging materials for electronic components, dividers, IC trays, conductive flooring, etc.