We also support new development projects! We have strengths in mass production using 500mm wide roll film.
NISSHA has refined its manufacturing technology for electronic components known as "film devices," which are based on film substrates. We challenge the development of film processing technologies that are generally considered impossible, such as roll-to-roll processing of ultra-thin COP film with a thickness of 55um or less, which can break with just a slight scratch, and cutting technology that allows for crack-free separation of products from roll film. Utilizing the know-how we have cultivated so far, we provide consistent support for our customers' product development and manufacturing, from device design to module processing. 【Features】 - Capable of supporting development and prototyping from material selection to circuit pattern design and module configuration. - Strength in mass production using roll film with a width of 500mm. - Capable of handling everything from patterning to individual cutting and module fabrication. *For more details, please refer to the related links or feel free to contact us.
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basic information
【Features of Film Devices】 ■ Base Film - Resin Types: PET, COP, PC, PI, etc. - Film Thickness: Capable of processing thin films under 100μm ■ Circuit Formation Materials - For Etching Process: Metal thin films (Cu, Ni, Cr, etc.), transparent conductive oxide films (ITO) - For Screen Printing: Ag paste, carbon paste, organic conductive materials - Others: Also compatible with special materials such as Ag nanowires ■ Photosensitive Resin - For insulating film processing, black matrix, well wall (depression) formation, etc. - Formation of functional films and structural patterns using processable materials ■ Patterning Accuracy - Etching Process: Line/Space = 10/10μm - Screen Printing: Line/Space = 50/50μm ■ Processing Size: Supports up to 500×1,000mm *For more details, please refer to the related links or feel free to contact us.
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Applications/Examples of results
"Please share your 'wish list' with us." ■ I want to create transparent electronic components. ■ I want to incorporate electronic circuits into curved housings. ■ I want to make flexible and stretchable electronic components. ■ I want to minimize the frame area of the display as much as possible. ■ I want to make the device as thin and light as possible. ■ Mass production in the millions, etc. *For more details, please refer to the related links or feel free to contact us.
Company information
NISSHA has continuously expanded its core technologies by integrating printing technology, which it has cultivated since its founding, with elements such as coating, molding, and metal processing. This has enabled the diversification of products and target markets, as well as entry into global markets, thereby achieving an expansion of its business domain. The current core technologies consist of "printing," "coating," "lamination," "molding," "patterning," and "metal processing," and they continue to evolve and expand by incorporating new technologies and materials.