A sticky sheet that can be easily detached by heating. It’s an excellent product that can be quickly removed with heat, even when firmly fixed! Ideal for improving the manufacturing efficiency of electronic components!
Nitto's heat release sheet "Riva Alpha" has adhesive properties at room temperature and can be easily peeled off simply by heating, making it a unique adhesive sheet. It significantly contributes to automation and labor-saving in various manufacturing processes of electronic components. ■ What is heat release? It was developed targeting a process where components and devices are firmly bonded during processing, and after heat treatment, the adhesive strength is lost, allowing for natural release. At room temperature, it adheres like a regular adhesive sheet. When you want to peel it off, simply heating it causes the adhesive layer to foam, reducing the adhesive area and allowing for natural release. ■ Mechanism of heat release The heat release adhesive layer contains capsules that expand when heat is applied. Therefore, when heat is applied, the capsules expand, creating a rough surface on the heat release adhesive layer, which eliminates the adhesive strength and allows the bonded object to be naturally released.
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basic information
■Features - At room temperature, it adheres like a regular adhesive sheet, and can be easily removed by simply applying heat when you want to peel it off. - You can choose from various processing shapes such as sheets, rolls, and labels. - You can select the heating temperature for peeling. - It can be reliably peeled off at a constant temperature, contributing to automation and labor-saving. - It does not damage the substrate when peeling off the tape. ■Benefits for Manufacturing Efficiency - Since the substrate can be securely fixed during processing, positional deviation is prevented, improving processing accuracy. - It can be used in long tape form, enabling continuous manufacturing processes. The ability to peel off instantly with heat greatly contributes to increased productivity. Additionally, it reduces the labor involved in peeling, promoting labor-saving. - When using wax or adhesives, a cleaning process is required to remove these with solvents after peeling, but Revalpha is a dry method that does not require a cleaning process. It minimizes contamination by impurities and external pollutants in a dry environment. - Natural peeling is possible without applying force, which prevents damage to the workpiece and contributes to improved yield. *For details such as product number selection, please feel free to contact us.
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Applications/Examples of results
● For temporary fixation during dicing of electronic components ● For temporary fixation to prevent misalignment ● For transfer applications of chip components Various temporary fixation, transfer, carriers, masking, protection, coating processing, etc.
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Company information
Our company is responsible for the living environment business within the Nitto Group and is engaged in important business activities that broadly relate to the socio-economy, including MRO and infrastructure businesses. We offer a wide range of products from over 400 related manufacturers and functional processed products, and we possess the know-how to quickly respond by transforming "customer voices" into tangible solutions. "Company Overview" Company Name: Nitto L Materials Corporation Established: June 1, 1979 *Formerly known as El Nissho Co., Ltd. Name changed in 2015 Capital: 800 million yen (100% owned by Nitto Denko Corporation) Annual Sales: 12.2 billion yen (Fiscal Year 2023) Number of Employees: 100