Technical Specialty Books - Low Dielectric Properties, Low Thermal Expansion, Transparency, Adhesion and Bonding Properties, Formability -
★ "5G Circuit Boards," "Flexible Organic EL," "Materials for LiB," "Onboard Drive Motors" Explaining the points of high functionality, performance improvement, and product application for new usage development! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Document 【5G Related Components】 - Low dielectric loss polyimide for 5G and millimeter wave applications - Development of low dielectric polyimide adhesives for FPC - Direct metallization on polyimide films 【Flexible Displays】 - Development status and technological direction towards low CTE transparent polyimide - Transparent polyimide for foldable smartphones - Flexible LCD using polyimide film substrates 【Insulation Materials for EV/HEV】 - Polyimide coatings for onboard drive motors that balance high insulation and high heat resistance - Required characteristics and adhesion improvement for motor winding insulation coatings 【Lithium-Ion Batteries】 - Development status of polyimide binders for high-capacity silicon-based anodes - Development and challenges of polyimide separators for lithium metal batteries 【Aerospace and Space Fields】 - Development trends of heat-resistant CFRP using polyimide as the base material - Application of thermoplastic polyimide to prepregs
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■ Table of Contents Chapter 1: Synthesis, Design, Structure, Properties, and Characteristics of Various Polyimides Chapter 2: Transparency of Polyimides, Improvement of Optical Properties, and Applications in Optical Devices Chapter 3: Reduction of Dielectric Loss in Polyimides and Applications in Electronic Circuit Boards and Devices Chapter 4: Surface Modification of Polyimides, Wiring Formation, and Improvement of Adhesion Chapter 5: High Thermal Conductivity of Polyimides and Application Technologies for Insulating Materials Chapter 6: Application Technologies of Polyimides in Energy Devices and Chemical Processes Chapter 7: Application Technologies of Polyimides in Aerospace and Structural Materials －－－－－－－－－－－－－－－－－－－－－－－－－－ ● Published: August 31, 2022 ● Authors: 57 ● Format: A4 size, 566 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-887-6 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86798-063-7 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
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