In-house integrated production of printed circuit boards is possible! Introducing the features of the boards, such as the number of layers and maximum size!
We would like to introduce our "Printed Circuit Board Manufacturing." The features of the boards include a thick electrolytic gold plating of 0.5 to 1.0 μm, layer counts ranging from single-sided to 30 layers, a maximum size of 670×590 mm, board thickness from 0.1 to 5.0 t, and a minimum hole diameter of Φ0.1. Additionally, we have manufacturing equipment that allows for in-house integrated production of printed wiring boards. 【Board Features】 ■ Thick electrolytic gold plating: 0.5 to 1.0 μm ■ Layer count: single-sided to 30 layers ■ Maximum size: 670×590 mm ■ Board thickness: 0.1 to 5.0 t ■ Minimum hole diameter: Φ0.1 ■ UL certified substrate ■ Special boards ・IVH boards, blind hole boards ・Controlled characteristic impedance boards *For more details, please refer to the PDF materials or feel free to contact us.
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Hano Manufacturing Co., Ltd. has manufacturing facilities capable of in-house integrated production of printed circuit boards, focusing on small-batch production of various types. We handle the design and manufacturing of high-density, multi-layer printed circuit boards, as well as the development of electronic products, assembly, and performance testing. We also design and produce various nameplates, film sheets, and panel casing processing that correspond to the exterior of electronic devices, aiming for comprehensive coordination in electronic device development.
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