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  6. Proposal for software and hardware design, implementation, and assembly services.

Proposal for software and hardware design, implementation, and assembly services.

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last updated:May 22, 2025

ヨーホー電子
ヨーホー電子
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We flexibly respond from software and hardware design to implementation and product assembly. "Yoho's adaptability" to the challenges of various manufacturers.

Through software and hardware design to board assembly and product assembly, we create new value together with our customers. Based on our unique development and assembly know-how, we respond to various requests such as development, parts procurement, discrete assembly, surface mount assembly, product assembly, and various inspections. In design, we focus on ease of manufacturing by utilizing our assembly know-how. In assembly, we accommodate various board implementations, including compact high-density boards, large control boards, and power supply boards. We have established our own quality control and delivery management, providing speedy service. ◆ Circuit Design: Supports analog and digital circuit design. CAD used: QuadCept, PADS, Altium Designer ◆ Software Design: Supports microcontroller software and applications (APP). Microcontroller software development achievements: Renesas, PIC, Infineon, STM, NXP, etc. APP development achievements: Android OS, iOS ◆ Mechanical Design: Capable of consistent support from prototypes to mass production. We own a large 3D printer and can accommodate prototype models up to 300×250×250mm.

    LED light source/moduleothersAutomated guided vehicles (AGV, RGV)
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Proposal for software and hardware design, implementation, and assembly services.

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  • Related Link - https://yoho-denshi.com/service.html

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【Hardware】  QuadCept, PADS, Alutium Designer 【Microcontroller Software】  Renesas, PIC, Infineon, STM, NXP, 8051, Sonix, Rock Chip  TI BLE microcontroller software, Telink microcontroller software  MTK7628・7688 software, ESP8266 WiFi software (ESPRESSIF) 【Implementation Capability and Precision】 <Surface (SMT) Mounting> ■Precision ・Chip Size: 0402 ・Lead Spacing: 0.3mm ・Adjacent Pitch: 0.1mm ■Compatible Chips: BGA, QFN, SOP, QFP, LED, etc. ■Compatible Sizes ・Maximum Size: 850mm×500mm ・Board Thickness: 0.5mm to 3.0mm 【Implementation Capability and Precision】 <Lead Component Mounting> ■Axial Insertion Machine ・Compatible with pitch from 5.0mm to 20.0mm ■Radial Insertion Machine ・Compatible with pitch from 2.5mm to 7.5mm ● We can accommodate requests for short delivery times, small quantities of various types, and manual soldering. *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

【Product Development Examples】 Wireless controlled lighting fixtures, lighting wireless control devices, WiFi/LAN communication compatible devices, server communication compatible IoT devices, wireless AC voltage regulators, BLE controlled models, scientific testing equipment, wireless controlled 3D signage, 360-degree IP cameras, LCD operation panels, tablets, electric heating devices, beauty equipment, UVA/UVC application devices. 【Wireless Development Examples】 150MHz radios, 60MHz radios, PTD radios, 400MHz satellite receivers/signal testers, GPS-equipped radios, 2.4GHz simultaneous communication radios, remote control receivers, vehicle-mounted transmitters, TCXO remote control transceivers, compact transceivers, toy wireless transceivers, NFC compatible devices, Bluetooth 2.0 application devices, BLE application devices. 【Control Development Examples】 Ice maker control boards, soap dispenser control boards, 3D gesture sensors, USB connected controllers, automatic door control devices, shutter control devices. *For more details, please refer to the PDF document or feel free to contact us.

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Proposal for software and hardware design, implementation, and assembly.

Proposal for software and hardware design, implementation, and assembly.

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Yoho Electronics Company Profile

Yoho Electronics Company Profile

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KOROSUKE Petit Product Catalog Vol: 1

KOROSUKE Petit Product Catalog Vol: 1

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Yoho Electronics - Proposal for LED for Signage

Yoho Electronics - Proposal for LED for Signage

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Proposal for large-scale substrate mounting

Proposal for large-scale substrate mounting

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Large-scale substrate mounting

Capable of supporting large PCB assembly in 850×500mm size.

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Supports large PCB assembly in 850×500mm size. [Accuracy] Chip size: 03015 Lead spacing: 0.3mm Adjacent pitch: 0.1mm [Supported Chips] BGA, CSP, QFN, SOP, QFP, LED, etc. [Supported Sizes] Minimum size: 50mm×50mm Maximum size: 500mm×850mm Board thickness: 0.5mm to 3.0mm

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ヨーホー電子

ヨーホー電子

Building materials, supplies and fixtures manufacturers

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At Yoho Electronics, we focus on circuit board assembly and respond to our customers' diverse requests (short delivery times, low costs, small quantities of various types, and mass production). Additionally, we achieve high product quality and reduced lead times through a consistent production system (from circuit board design and assembly to final assembly) and our unique production technology and quality control system. Our own surface-emitting LED product "KITERETSU" has also been widely adopted in outdoor signage and light walls and ceilings in commercial facilities, receiving positive feedback.

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